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Improvements of the Epoxy–Copper Adhesion for Microelectronic Applications

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https://hal.archives-ouvertes.fr/hal-02641688
Contributor : Nicole Fréty <>
Submitted on : Thursday, May 28, 2020 - 5:41:43 PM
Last modification on : Wednesday, October 7, 2020 - 3:16:04 PM

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Lérys Granado, Stefan Kempa, Laurence John Gregoriades, Frank Brüning, Tobias Bernhard, et al.. Improvements of the Epoxy–Copper Adhesion for Microelectronic Applications. ACS Applied Electronic Materials, American Chemical Society, 2019, 1 (8), pp.1498-1505. ⟨10.1021/acsaelm.9b00290⟩. ⟨hal-02641688⟩

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