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Communication Dans Un Congrès Année : 2013

Temperature impact (up to 200°C) on performance and reliability of HfO2-based RRAMs

Résumé

This paper provides an overview of the temperature impact (up to 200 °C) on the electrical behavior of oxide-based RRAM, during forming, low-field resistance reading, SET/RESET, disturb, data retention and endurance. HfO 2-RRAM devices (in a 1T1R configuration) integrated in an advanced 65 nm technology are studied for this aim. We show that forming operation is strongly activated in temperature (i.e.-0.5 V per hundred Celsius degree), being much less for SET and RESET voltages (i.e. <-0.05 V per hundred Celsius degree); disturb of HRS at fixed voltage showed to be independent of temperature; endurance up to 3.10 6 cycles, with optimized set of stress parameters showed no significant variation; data retention at 150 °C up to 68 days showed stable programming window, after different initial programming algorithms.
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Dates et versions

hal-01738426 , version 1 (20-03-2018)

Identifiants

Citer

T. Cabout, L. Perniola, V. Jousseaume, H. Grampeix, J.F. Nodin, et al.. Temperature impact (up to 200°C) on performance and reliability of HfO2-based RRAMs. 2013 5th IEEE International Memory Workshop (IMW), May 2013, Monterey, United States. ⟨10.1109/IMW.2013.6582112⟩. ⟨hal-01738426⟩
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