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Article Dans Une Revue Applied Thermal Engineering Année : 2010

A comparison of flow boiling heat-transfer in in-line mini pin fin and plane channel flows

Résumé

The use of a boiling fluid as a coolant is an attractive option for electronic devices as electrical power densities increase. However, for systems working at the micro-scale, design methods developed for evaluating heat transfer in macro-scale evaporators are not appropriate for passages with hydraulic diameter of the order of 1mm and below.
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Dates et versions

hal-00675401 , version 1 (01-03-2012)

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D.A. Mcneil, A.H. Raeisi, P.A. Kew, P.R. Bobbili. A comparison of flow boiling heat-transfer in in-line mini pin fin and plane channel flows. Applied Thermal Engineering, 2010, 30 (16), pp.2412. ⟨10.1016/j.applthermaleng.2010.06.011⟩. ⟨hal-00675401⟩

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