Thermophoretic Hydromagnetic Dissipative Heat and Mass Transfer with Lateral Mass Flux, Heat Source, Ohmic Heating and Thermal Conductivity Effects: Network Simulation Numerical Study

Joaquín Zueco , O. Anwar Bég , H.S. Takhar , V.R. Prasad

A two-dimensional mathematical model is presented for the laminar heat and mass transfer of an electrically-conducting, heat generating/absorbing fluid past a perforated horizontal surface in the presence viscous and Joule (Ohmic) heating. The Talbot-Cheng-Scheffer-Willis formulation (1980) is used to introduce a thermophoretic coefficient into the concentration boundary layer equation. The governing partial differential equations are non-dimensionalized and transformed into a system of nonlinear ordinary differential similarity equations, in a single independent variable, . The resulting coupled, nonlinear equations are solved under appropriate transformed boundary conditions using the Network Simulation Method. Computations are performed for a wide range of the governing flow parameters, viz Prandtl number, thermophoretic coefficient (a function of Knudsen number), Eckert number (viscous heating effect), thermal conductivity parameter, heat absorption/generation parameter, wall transpiration parameter, Hartmann number and Schmidt number. The numerical details are discussed with relevant applications. Excellent correlation is achieved with earlier studies due to White (1974) and Chamkha and Issa (2000). The present problem finds applications in optical fiber fabrication, aerosol filter precipitators, particle deposition on hydronautical blades, semiconductor wafer design, thermo-electronics and nuclear hazards.

Mots clés: Thermophoresis; magnetohydrodynamics; heat and mass transfer; Prandtl number; Knudsen number; Hartmann number; Eckert number; Schmidt number; network simulation model; heat sinks/sources

Joaquín Zueco, O. Anwar Bég, H.S. Takhar, V.R. Prasad. Thermophoretic Hydromagnetic Dissipative Heat and Mass Transfer with Lateral Mass Flux, Heat Source, Ohmic Heating and Thermal Conductivity Effects: Network Simulation Numerical Study. Applied Thermal Engineering, 2009, 29 (14-15), pp.2808. ⟨10.1016/j.applthermaleng.2009.01.015⟩. ⟨hal-00556846⟩