Micromechanical model for cohesive materials based upon pseudo-granular structure

Anil Misra (1) , Yang Yang (1, 2)

1 CEAE - Department of Civil, Environmental and Architectural Engineering
2 Faculty of Engineering [Wuham]

A micromechanical model for cohesive materials is derived by considering their underlying microstructure conceptualized as a collection of grains interacting through pseudo-bonds. The pseudo-bond or the inter-granular force–displacement relations are formulated taking inspiration from the atomistic-level particle interactions. These force–displacement relationships are then used to derive the incremental stiffnesses at the grain-scale, and consequently, obtain the sample-scale stress–strain relationship of a representative volume of the material. The derived relationship is utilized to study the stress–strain and failure behavior including the volume change and ‘‘brittle” to ‘‘ductile” transition behavior of cohesive materials under multi-axial loading condition. The model calculations are compared with available measured data for model validation. Model predictions exhibit both quantitative and qualitative consistency with the observed behavior of cohesive material.

Mots clés: micromechanics; failure surface; cohesive materials; multi-scale modeling; granular media

Domaines: Génie mécanique [physics.class-ph]; Génie mécanique [physics.class-ph]

Anil Misra, Yang Yang. Micromechanical model for cohesive materials based upon pseudo-granular structure. International Journal of Solids and Structures, 2010, 47 (21), pp.2970-2981. ⟨hal-00556078⟩