Macromodeling strategy for digital devices and interconnects

Igor Simone Stievano (1) , Z. Chen , D. Becker , Flavio G. Canavero (2) , S. Grivet-Talocia , G. Katopis , Ivan Maio (3)

1 EMC Group
2 Dipartimento di Elettronica
3 DELEN - Department of Electronics [Torino]

This paper proposes a macromodeling approach for the simulation of digital interconnected systems. Such an approach is based on a set of macromodels describing IC ports, IC packages and multiconductor interconnect structures in standard circuit simulators, like SPICE. We illustrate the features of the macromodels and we demonstrate the proposed approach on a realistic simulation problem.

Mots clés: EMC; IC; emission; immunity; susceptibility; modelling; IEC; integrated circuit; electromagnetic compatibility

Domaines: Micro et nanotechnologies/Microélectronique

Igor Simone Stievano, Z. Chen, D. Becker, Flavio G. Canavero, S. Grivet-Talocia, et al.. Macromodeling strategy for digital devices and interconnects. 3rd International Workshop on Electromagnetic Compatibility of Integrated Circuits, Nov 2002, Toulouse, France. pp. 53-56. ⟨hal-00519354⟩