Microstructure, indentation and work hardening of Cu/Ag multilayers

Marc Verdier (1) , H. Huang (2) , Frans Spaepen (3) , J. David Embury (4) , Harriet Kung (5)

1 LTPCM - Laboratoire de thermodynamique et physico-chimie métallurgiques
2 SEAS - Harvard John A. Paulson School of Engineering and Applied Sciences
3 Div. of Eng. and Applied Sciences
4 Materials Science and Engineering
5 LANL - Los Alamos National Laboratory

Instrumented indentation and tensile tests were performed on free standing Cu/Ag multilayer thin films with layer thicknesses in the range 0.85-900 nm. The effect of layer thickness can be described by a Hall-Petch relationship. The work hardening rate in the tensile test depends on layer thickness which indicates that the interfaces create storage sites for dislocations and follows an inverse power law.

Mots clés: Physical Sciences

Marc Verdier, H. Huang, Frans Spaepen, J. David Embury, Harriet Kung. Microstructure, indentation and work hardening of Cu/Ag multilayers. Philosophical Magazine, 2006, 86 (32), pp.5009-5016. ⟨10.1080/14786430600746440⟩. ⟨hal-00513707⟩