AN INTEGRATED CIRCUIT COMPATIBLE COMPACT PACKAGE FOR THERMAL GAS FLOWMETERS

P. Bruschi (1) , V. Nurra (1)

1 Dipartimento di Ingegneria dell'Informazione [Pisa]

An original packaging method suitable for integrated thermal mass flow sensors is presented. The method consists in the application of a plastic transparent adapter to the chip surface. The adapter is sealed to the chip surface by means of a thermal procedure. By this approach it is possible to selectively convey the fluid flow to reduced chip areas, avoiding contact with the pads. Fabrication and testing of a very compact flow sensor is described.

Mots clés: Devices

Domaines: Autre [cs.OH]; Architectures Matérielles [cs.AR]

P. Bruschi, V. Nurra. AN INTEGRATED CIRCUIT COMPATIBLE COMPACT PACKAGE FOR THERMAL GAS FLOWMETERS. DTIP 2007, Apr 2007, Stresa, lago Maggiore, Italy. pp.215-219. ⟨hal-00257691⟩