Vibration Combined High Temperature Cycle Tests for Capacitive MEMS Accelerometers

Z. Szucs (1) , G. Nagy (1) , S. Hodossy (1) , M. Rencz (1) , A. Poppe (1)

1 Department of Electron Devices

In this paper vibration combined high temperature cycle tests for packaged capacitive SOI-MEMS accelerometers are presented. The aim of these tests is to provide useful Design for Reliability information for MEMS designers. A high temperature test chamber and a chopper-stabilized read-out circuitry were designed and realized at BME - DED. Twenty thermal cycles of combined Temperature Cycle Test and Fatigue Vibration Test has been carried out on 5 samples. Statistical evaluation of the test results showed that degradation has started in 3 out of the 5 samples.

Mots clés: Vibration; temperature cycle tests; reliability; MEMS

Domaines: Science des matériaux [cond-mat.mtrl-sci]

Z. Szucs, G. Nagy, S. Hodossy, M. Rencz, A. Poppe. Vibration Combined High Temperature Cycle Tests for Capacitive MEMS Accelerometers. THERMINIC 2007, Sep 2007, Budapest, Hungary. pp.215-219. ⟨hal-00202563⟩