HIGH PERFORMANCE THERMAL INTERFACE TECHNOLOGY OVERVIEW

R. Linderman (1) , T. Brunschwiler (1) , B. Smith (1) , B. Michel (1)

1 Zurich Research Laboratory

An overview on recent developments in thermal interfaces is given with a focus on a novel thermal interface technology that allows the formation of 2-3 times thinner bondlines with strongly improved thermal properties at lower assembly pressures. This is achieved using nested hierarchical surface channels to control the particle stacking with highly particle-filled materials. Reliability testing with thermal cycling has also demonstrated a decrease in thermal resistance after extended times with longer overall lifetime compared to a flat interface.

Mots clés: Reliability Issues; turbulence Modelling in Complex Geometrics

Domaines: Science des matériaux [cond-mat.mtrl-sci]

R. Linderman, T. Brunschwiler, B. Smith, B. Michel. HIGH PERFORMANCE THERMAL INTERFACE TECHNOLOGY OVERVIEW. THERMINIC 2007, Sep 2007, Budapest, Hungary. pp.129-134. ⟨hal-00202548⟩