Development of the Micro Capillary Pumped Loop for Electronic Cooling

S.-H. Moon (1) , G. Hwang (1)

1 Microsystem Team

Electronic devices have been minimized but the performances of those becoming better and better. Therefore it is needed to develop new cooling methods suitable for a thin packaging structure with high thermal density. As an alternative method the thin flat plate type micro CPL(capillary pumped loop) with the thickness less than 2mm was developed in this study. The proposed micro CPL in this study has two staged grooves in evaporator instead of poles for preventing backflows of the vapor bubble and the simpler structure than that of the pole type. Also an additional vapor space over from the evaporator to the condenser is made on the upper substrate therefore flow resistance of the vapor could be reduced. The micro CPL was fabricated using MEMS technology. This micro CPL is divided into lower, middle and upper substrate. The lower substrate is made of silicon and the middle and upper substrate is made of Pyrex glass for visualization. Through a preliminary test it was checked that there was no leakage at the adhesion part between lower and middle or upper substrates and at the bonding part between the lower substrate and the fill tube for filling of the working fluid. Although the experimental study for the micro CPL has been poor till now, we have obtained the reasonable experimental results for the micro CPL in this study. The performance test result has showed 8.5W of the heat transfer rate for the micro CPL and also we could observe the operating characteristics which was circulating or moving characteristics by visualization. Pure distilled water was used as the working fluid.

Mots clés: Electronic cooling; Two-phase change; Capillary pumped loop; Heat transport

Domaines: Science des matériaux [cond-mat.mtrl-sci]

S.-H. Moon, G. Hwang. Development of the Micro Capillary Pumped Loop for Electronic Cooling. THERMINIC 2007, Sep 2007, Budapest, Hungary. pp.72-76. ⟨hal-00202537⟩