A Novel VLSI Technology to Manufacture High-Density Thermoelectric Cooling Devices

H. Chen (1) , L. Hsu (1) , X. Wei (1)

1 IBM Corporation, New York

This paper describes a novel integrated circuit technology to manufacture high-density thermoelectric devices on a semiconductor wafer. With no moving parts, a thermoelectric cooler operates quietly, allows cooling below ambient temperature, and may be used for temperature control or heating if the direction of current flow is reversed. By using a monolithic process to increase the number of thermoelectric couples, the proposed solid-state cooling technology can be combined with traditional air cooling, liquid cooling, and phase-change cooling to yield greater heat flux and provide better cooling capability.

Mots clés: Thermoelectric Cooling Technology

Domaines: Science des matériaux [cond-mat.mtrl-sci]

H. Chen, L. Hsu, X. Wei. A Novel VLSI Technology to Manufacture High-Density Thermoelectric Cooling Devices. THERMINIC 2007, Sep 2007, Budapest, Hungary. pp.66-71. ⟨hal-00202536⟩