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| HAL : hal-00202536, version 1 |
| arXiv : 0801.0997 |
| Fiche détaillée |  Récupérer au format |
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| THERMINIC 2007, Budapest : Hungary (2007) |
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| A Novel VLSI Technology to Manufacture High-Density Thermoelectric Cooling Devices |
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| H. Chen 1L. Hsu 1 |
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| (09/2007) |
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| This paper describes a novel integrated circuit technology to manufacture high-density thermoelectric devices on a semiconductor wafer. With no moving parts, a thermoelectric cooler operates quietly, allows cooling below ambient temperature, and may be used for temperature control or heating if the direction of current flow is reversed. By using a monolithic process to increase the number of thermoelectric couples, the proposed solid-state cooling technology can be combined with traditional air cooling, liquid cooling, and phase-change cooling to yield greater heat flux and provide better cooling capability. |
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| 1 : | IBM Corporation, New York |
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IBM Corporation |
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| Domaine | : | Physique/Matière Condensée/Science des matériaux |
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| Thermoelectric Cooling Technology |
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| Liste des fichiers attachés à ce document : | |||||
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| hal-00202536, version 1 | |
| http://hal.archives-ouvertes.fr/hal-00202536 | |
| oai:hal.archives-ouvertes.fr:hal-00202536 | |
| Contributeur : EDA Publishing Association | |
| Soumis le : Lundi 7 Janvier 2008, 12:11:07 | |
| Dernière modification le : Lundi 7 Janvier 2008, 15:34:32 | |
