Development of EHD Ion-Drag Micropump for Microscale Electronics Cooling Systems

C.K. Lee (1) , A.J. Robinson (1) , C.Y. Ching (2)

1 Department of Mechanical and Manufacturing Engineering [Trinity College Dublin]
2 Dept. of Mechanical Engineering

In this investigation, the numerical simulation of electrohydrodynamic (EHD) ion-drag micropumps with micropillar electrode geometries have been performed. The effect of micropillar height and electrode spacing on the performance of the micropumps was investigated. The performance of the EHD micropump improved with increased applied voltage and decreased electrode spacing. The optimum micropillar height for the micropump with electrode spacing of 40µm and channel height of 100µm at 200V was 40µm, where a maximum mass flow rate of 0.18g/min was predicted. Compared to that of planar electrodes, the 3D micropillar electrode geometry enhanced the overall performance of the EHD micropumps.

Mots clés: Electrohydrodynamics; Micropump; Electronics cooling

Domaines: Science des matériaux [cond-mat.mtrl-sci]

C.K. Lee, A.J. Robinson, C.Y. Ching. Development of EHD Ion-Drag Micropump for Microscale Electronics Cooling Systems. THERMINIC 2007, Sep 2007, Budapest, Hungary. pp.48-53. ⟨hal-00202533⟩