| HAL : hal-00202533, version 1 |
| arXiv : 0801.1001 |
| Fiche détaillée | Récupérer au format |
|
|
| THERMINIC 2007, Budapest : Hungary (2007) |
|
|
|
|
| Development of EHD Ion-Drag Micropump for Microscale Electronics Cooling Systems |
|
|
| C.K. Lee 1A.J. Robinson 1 |
|
|
| (09/2007) |
|
|
| In this investigation, the numerical simulation of electrohydrodynamic (EHD) ion-drag micropumps with micropillar electrode geometries have been performed. The effect of micropillar height and electrode spacing on the performance of the micropumps was investigated. The performance of the EHD micropump improved with increased applied voltage and decreased electrode spacing. The optimum micropillar height for the micropump with electrode spacing of 40µm and channel height of 100µm at 200V was 40µm, where a maximum mass flow rate of 0.18g/min was predicted. Compared to that of planar electrodes, the 3D micropillar electrode geometry enhanced the overall performance of the EHD micropumps. |
|
|
|
|
|
|
|
|
|
|
| 1 : | Dep. of Mechanical Engineering |
| Trinity College Dublin | |
| 2 : | Dept. of Mechanical Engineering |
| McMaster University | |
|
|
|
|
|
|
|
|
| Domaine | : | Physique/Matière Condensée/Science des matériaux |
|
|
| Electrohydrodynamics – Micropump – Electronics cooling |
|
|
| Liste des fichiers attachés à ce document : | |||||
|
|
|
| hal-00202533, version 1 | |
| http://hal.archives-ouvertes.fr/hal-00202533 | |
| oai:hal.archives-ouvertes.fr:hal-00202533 | |
| Contributeur : EDA Publishing Association | |
| Soumis le : Lundi 7 Janvier 2008, 12:11:03 | |
| Dernière modification le : Lundi 7 Janvier 2008, 15:39:00 | |