New Reliability Assessment Method for Solder Joints in BGA Package by Considering the Interaction between Design Factors

Satoshi Kondo (1) , Qiang Yu (1) , T. Shibutani (1) , M. Shiratori (1)

1 Department of Mechanical Engineering and Materials Science

As the integration and the miniaturization of electronics devices, design space become narrower and interactions between design factors affect their reliability. This paper presents a methodology of quantifying the interaction of each design factor in electronics devices. Thermal fatigue reliability of BGA assembly was assessed with the consideration of the interaction between design factors. Sensitivity analysis shows the influence of each design factor to inelastic strain range of a solder joint characterizing the thermal fatigue life if no interaction occurs. However, there is the interaction in BGA assembly since inelastic strain range depends on not only a mismatch in CTE but also a warpage of components. Clustering can help engineers to clarify the relation between design factors. The variation in the influence was taken to quantify the interaction of each design factor. Based on the interaction, simple evaluating approach of inelastic strain range for the BGA assembly was also developed. BGA package was simplified into a homogeneous component and equivalent CTE wascalculated from the warpage of BGA and PCB. The estimated equation was derived by using the response surface method as a function of design factors. Based upon these analytical results, design engineers can rate each factor's effect on reliability and assess the reliability of their basic design plan at the concept design stage.

Mots clés: Reliability Issues; Reliability Evolution and Prediction

Domaines: Science des matériaux [cond-mat.mtrl-sci]

Satoshi Kondo, Qiang Yu, T. Shibutani, M. Shiratori. New Reliability Assessment Method for Solder Joints in BGA Package by Considering the Interaction between Design Factors. THERMINIC 2007, Sep 2007, Budapest, Hungary. pp.26-31. ⟨hal-00202529⟩