Thermal Fatigue Assessment of Lead-Free Solder Joints

Qiang Yu (1) , M. Shiratori (1)

1 Department of Mechanical Engineering and Materials Science

In this paper the authors have investigated the thermal fatigue reliability of lead-free solder joints. They have focused their attention to the formation of the intermetallic compound and its effect on the initiation and propagation behaviors of fatigue cracks. Furthermore, they also studied the effect of voids in the solder joints on the fatigue reliability.

Mots clés: Thermal Stress Failures : Prediction and Prevention; Reliability evolution and prediction

Domaines: Architectures Matérielles [cs.AR]

Qiang Yu, M. Shiratori. Thermal Fatigue Assessment of Lead-Free Solder Joints. THERMINIC 2005, Sep 2005, Belgirate, Lago Maggiore, Italy. pp.204-211. ⟨hal-00189474⟩