Electro-thermal-mechanical Analysis of A HQUAD Package for High Current and High Power Application

L.-Caroline Chen (1) , H. Oprins (1) , B. Vandevelde (1) , G. Brizar (2) , D. Vanderstraeten (2) , E. Blansaer (2)

1 IMEC Leuven
2 AMI Semiconductor Oudenaarde

The reliability for high electrical current densities through the first level interconnections using wire bonding was studied theoretically. First an analytical model was developed to give a first insight in the temperature rise in wire bonds under a certain electrical currents. Then a delicate 3D FEM model was built to employ the full electrical-thermal-mechanical coupling simulation. The thermal performance, temperature rising and stress distribution in the package were presented. The influence of wire material properties, diameter, and other adjacent materials (such as die attach, mould compound) are discussed. Based on our study, for a particular package solution HQUAD-64 requiring 3.3 A per wire, the best wire material would be copper. Beside, diameters of wires are playing important role. Wires with 25µm diameter are not capable to withstand for a long time, even when copper wires are used. While for using 50µm diameter wires, the maximum wire temperatures decreases by a factor 50 to 100 to reasonable but still high temperatures.

Mots clés: high power; wire bond; HQuad 64 package; electro-thermal FEM; high current

Domaines: Architectures Matérielles [cs.AR]

L.-Caroline Chen, H. Oprins, B. Vandevelde, G. Brizar, D. Vanderstraeten, et al.. Electro-thermal-mechanical Analysis of A HQUAD Package for High Current and High Power Application. THERMINIC 2005, Sep 2005, Belgirate, Lago Maggiore, Italy. pp.173-178. ⟨hal-00189471⟩