Minimizing the Bondline Thermal Resistance in Thermal Interface Materials Without Affecting Reliability

J. A. Emerson (1) , M. J. Rightley (1) , J.A. Galloway (1) , D. F. Rae (1, 2) , Dale. L. Huber (1) , Eric J. Cotts (2)

1 SNL - Sandia National Laboratories [Albuquerque]
2 Dep. of Physics

As electronic assemblies become more compact, with increased processing bandwidth and higher energy fluxes, thermal management is limiting several critical applications. The major technology limitation is the nonmetallic joining of devices to heat sinks using existing commercial thermal interface materials (TIMs). The present study starts a systematic study of the coupled interactions between materials formulation, manufacturing process, and thermal performance.

Mots clés: Electronic assemblies thermal interface materials (TIM) thermal conductivity adhesive surface sciences heat transport at sub-micron scales in microelectronics packaging bondline microstructure laser flash diffusivity measurements

Domaines: Architectures Matérielles [cs.AR]

J. A. Emerson, M. J. Rightley, J.A. Galloway, D. F. Rae, Dale. L. Huber, et al.. Minimizing the Bondline Thermal Resistance in Thermal Interface Materials Without Affecting Reliability. THERMINIC 2005, Sep 2005, Belgirate, Lago Maggiore, Italy. pp.106-111. ⟨hal-00189460⟩