Thermal And Thermo-Mechanical Modelling of Polymer Overmoulded Electronics

F. Sarvar (1) , D.C. Whalley (1) , D.A. Hutt (1) , N.J. Teh (2) , P.J. Palmer (1)

1 Interdisciplinary Center of Sleep Medicine
2 TWI Ltd [Cambridge]

This paper reports on the results from a research project investigating a novel technology for the manufacture of recyclable polymeric modules with embedded electronic controls and power distribution. The aim of this project is to develop a technology that fully encapsulates electronics for use in the demanding automotive environment. A two shot moulding technology will protect delicate electronic circuitry mounted outside of the passenger compartment from extremes of temperature, vibration and humidity. The resultant assemblies will also be readily recyclable, making it possible to cost-effectively separate electronic components from the polymer at the end of vehicle life, allowing the recovery of high purity recyclate.

Mots clés: Thermal modelling; Polymer; Encapsulation; Injection Moulding; Electronics; Overmoulding; Recycling

Domaines: Architectures Matérielles [cs.AR]

F. Sarvar, D.C. Whalley, D.A. Hutt, N.J. Teh, P.J. Palmer. Thermal And Thermo-Mechanical Modelling of Polymer Overmoulded Electronics. THERMINIC 2005, Sep 2005, Belgirate, Lago Maggiore, Italy. pp.98-105. ⟨hal-00189459⟩