Transient thermal simulation of a power hybrid module using an analytical solution of the heat equation
Résumé
This paper presents a method for the analysis of transient thermal states in electronic circuits using an analytical solution of the heat equation. The time dependent, threedimensional temperature fields in multilayered structures can be computed analytically using the Green's functions. The proposed method is illustrated based on a practical example, where the results of thermal simulations of a real hybrid module are compared with infrared temperature measurements. Additionally, the discussion of simulation errors caused mainly by different non-linear phenomena is included.
Domaines
Architectures Matérielles [cs.AR]
Origine : Fichiers produits par l'(les) auteur(s)
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