CAPACITIVE TEST-STRUCTURES DESIGN METHODOLOGY FOR THE EXTRACTION OF AIR-GAP AND DIELECTRIC THICKNESS OF A MEMS PROCESS - Archive ouverte HAL Accéder directement au contenu
Communication Dans Un Congrès Année : 2006

CAPACITIVE TEST-STRUCTURES DESIGN METHODOLOGY FOR THE EXTRACTION OF AIR-GAP AND DIELECTRIC THICKNESS OF A MEMS PROCESS

Résumé

The air-gap and dielectric thicknesses are key technology parameters of a micromachining fabrication process; their correct estimation is necessary for both good prediction of MEMS devices behavior and process monitoring. In this paper we present a methodology for their accurate quantification making use of capacitive test-structures, in order to allow automated data-extraction or, in general, capacitance measurements with standard lab instrumentation; the parameters are computed from measurements through a simple analytical model. Model validation and robustness to main parameters deviations and undesired mechanical effects are investigated by finite element analysis using CoventorWare_.
Fichier principal
Vignette du fichier
dtip06305.pdf (503.33 Ko) Télécharger le fichier
Origine : Fichiers produits par l'(les) auteur(s)
Loading...

Dates et versions

hal-00189308 , version 1 (20-11-2007)

Identifiants

  • HAL Id : hal-00189308 , version 1

Citer

M. Bellei, B. Margesin, R. Gaddi, A. Gnudi, F. Giacomozzi. CAPACITIVE TEST-STRUCTURES DESIGN METHODOLOGY FOR THE EXTRACTION OF AIR-GAP AND DIELECTRIC THICKNESS OF A MEMS PROCESS. DTIP 2006, Apr 2006, Stresa, Lago Maggiore, Italy. 5 p. ⟨hal-00189308⟩

Collections

DTIP
29 Consultations
424 Téléchargements

Partager

Gmail Facebook X LinkedIn More