3-D SELF-ASSEMBLED SOI MEMS: AN EXAMPLE OF MULTIPHYSICS SIMULATION

C. Mendez (1) , C. Louis (1) , S. Paquay (1) , P. de Vincenzo (1) , I. Klapka (1) , V. Rochus (2) , F. Iker (3) , Nicolas André (3) , J.-P. Raskin (3)

1 Open Engineering
2 LTAS, Vibrations et Identification des structures
3 UCL - Université Catholique de Louvain = Catholic University of Louvain

MEMS devices are typical systems where multiphysics simulations are unavoidable. In this work, we present possible applications of 3-D self-assembled SOI (Silicon-on-Insulator) MEMS such as, for instance, thermal actuators and flow sensors. The numerical simulations of these microsystems are presented. Structural and thermal parts have to be strongly coupled for correctly describing the fabrication process and for simulating the behavior of these 3-D SOI MEMS.

Domaines: Architectures Matérielles [cs.AR]

C. Mendez, C. Louis, S. Paquay, P. de Vincenzo, I. Klapka, et al.. 3-D SELF-ASSEMBLED SOI MEMS: AN EXAMPLE OF MULTIPHYSICS SIMULATION. DTIP 2006, Apr 2006, Stresa, Lago Maggiore, Italy. 5 p. ⟨hal-00189252⟩