Dynamic Thermal Analysis of a Power Amplifier

J. Banaszczyk (1) , G. de Mey (2) , M. Janicki (1) , A. Napieralski (1) , B. Vermeersch (2) , P. Kawka (2, 3)

1 Department of Electronics and Computer Science
2 ELIS - Department of Electronics and Information Systems - Ghent University
3 Agilent Technologies

This paper presents dynamic thermal analyses of a power amplifier. All the investigations are based on the transient junction temperature measurements performed during the circuit cooling process. The presented results include the cooling curves, the structure functions, the thermal time constant distribution and the Nyquist plot of the thermal impedance. The experiments carried out demonstrated the influence of the contact resistance and the position of the entire cooling assembly on the obtained results.

Mots clés: Structure functions; dynamic thermal analysis; power amplifier

Domaines: Science des matériaux [cond-mat.mtrl-sci]

J. Banaszczyk, G. de Mey, M. Janicki, A. Napieralski, B. Vermeersch, et al.. Dynamic Thermal Analysis of a Power Amplifier. THERMINIC 2006, Sep 2006, Nice, France. pp.128-132. ⟨hal-00171392⟩