Lumped electro-thermal model of on-chip interconnects

N. Spennagallo (1) , L. Codecasa (1) , Dario d'Amore (1) , P. Maffezzoni (1)

1 Dipartimento di Elettronica e Informazione

The paper proposes a compact but accurate electro-thermal model of a long on-chip interconnect embedded in a ULSI circuit. The model is well suited to be interfaced with the commercially available tools employed in ICs design for interconnect parasitic extraction.

Mots clés: ULSI interconnects; electro-thermal model; thermal-aware design

Domaines: Science des matériaux [cond-mat.mtrl-sci]

N. Spennagallo, L. Codecasa, Dario d'Amore, P. Maffezzoni. Lumped electro-thermal model of on-chip interconnects. THERMINIC 2006, Sep 2006, Nice, France. pp.220-224. ⟨hal-00171379⟩