. Lpe, Insight into the history of PCBs, The origins and evolution of the PCB: a review, vol.31, pp.41-45, 2005.

K. Gilleo and J. Murray, The Definitive History of the Printed Circuit

K. Gilleo and &. Murray, Radio with the first Printed Circuit Board by Paul Eisler, 1942, Science Museum / Science & Society Picture Library. Image, p.10439336, 1999.

M. J. Renn and R. Pastel, Direct writing of materials by laser guidance, Conference on Lasers and Electro-Optics, 1999.

J. Lee, A monolithic thermal inkjet printhead utilizing electrochemical etching and two-step electroplating techniques, Proceedings of International Electron Devices Meeting, pp.601-604, 1995.

J. Chen, K. D. Wise-;-mortara, L. Hughes, J. Ramsundar, P. Livesey et al., A low cost method to synthesize silver nanoparticles for the screen printing conductive inks, 2018 IEEE Research and Applications of Photonics In Defense Conference (RAPID), vol.44, pp.1121-1124, 1997.

V. Leblanc, J. Chen, P. Mardilovich, V. Bulovic, and M. A. Schmidt, Evaporative Printing of Organic Materials at Ambient Pressure using a Micromachined Printhead, TRANSDUCERS 2007 -2007 International Solid-State Sensors, Actuators and Microsystems Conference, pp.121-124, 2007.

H. Kang, G. Lee, Y. Nam, ;. Matav?, R. C. Frunz? et al., Inkjet-printed gold nanorods using biocompatible polyelectrolyte layer-bylayer coating for patterned photothermal applications, Joint IEEE International Symposium on the Applications of Ferroelectrics, European Conference on Application of Polar Dielectrics, and Piezoelectric Force Microscopy Workshop, pp.1-4, 2016.

E. Halonen, T. Viiru, K. Ostman, A. L. Cabezas, M. Mantysalo-;-seth-york et al., Etude des propriétés électriques d'un matériau polyimide à haute température : Application à la passivation des composants de puissance en carbure de silicium », thèse de doctorat en Génie électrique, sous la direction de Marie-Laure LOCATELLI, Laboratoire de Génie Electrique de Toulouse, 30 mars 2006 [I.19] FUJIFILM, « FUJIFILM Dimatix Introduces New DMP-3000 Materials Printer at the Large-area, Organic & Printed Electronics Convention (LOPE-C) in Frankfurt, Multimaterial Inkjet Technology for The Fabrication of Multilayer Components. Mediterranean Microwave Symposium (13ème MMS), vol.3, pp.1-3, 2013.

;. T. Consulté-sur, J. Levesque, A. Jang, P. Smetana, and . Stiles, Dip Pen Nanolithography® (DPN®) and the Deposition of Multiple Materials in Nanopatterning, 2010 Fourth International Conference on Quantum, Nano and Micro Technologies, pp.48-52, 2010.

. O'connell, . Higgins, &. Michael, R. &. Sullivan, S. &. Moulton et al., Inkon-Probe Hydrodynamics in Atomic Force Microscope Deposition of Liquid Inks, 2014.

T. Watanabe, Pulsed laser deposition of dielectric and superconducting materials: Mechanisms and applications, Digest IEEE/Leos 1996 Summer Topical Meeting. Advanced Applications of Lasers in Materials and Processing, vol.15, pp.3-4, 1996.

V. &. Califano, F. &. Bloisi, . Vicari, &. Luciano, P. &. Colombi et al., MAPLE deposition of biomaterial multilayers, APPLIED SURFACE SCIENCE, 2008.

L. &. Rapp, . Diallo, A. &. Abdou-&-alloncle, C. &. Videlot-ackermann, and P. Delaporte, , 2009.

, Pulsed-laser printing of organic thin-film transistors, Applied Physics Letters, vol.95

M. Morales, D. Munoz-martin, A. Marquez, S. Lauzurica, and C. Molpeceres, Laser-Induced Forward Transfer Techniques and Applications, pp.339-379, 2018.

M. Morales, D. Munoz-martin, S. Lauzurica, A. Márquez, Y. Chen et al., Application To Solar Cell Metallization and Bio-Printing », [présentattion], Centro Láser UPM, images?q=tbn:ANd9GcSqBCKazkvBegex2si6fLB3uO93UlhjTng8n32scL5gowYqZOWYYQ, vol.6, p.85013, 2014.

. Bhattacharya, . Sourin, A. Lutfurakhmanov, J. M. Hoey, . Swenson et al., Characterization and Modeling of K-Band Coplanar Waveguides Digitally Manufactured Using Pulsed Picosecond Laser Machining of Thick-Film Conductive Paste, Proceedings of the ASME 2012 International Mechanical Engineering Congress and Exposition, vol.7, pp.3180-3187, 2005.

M. N. Nguyen, R. L. Parkhill, R. M. Taylor, K. H. Church, ;. Mihaela et al., Controlling and assessing the quality of aerosol jet printed features for large area and flexible electronics, Rapid Prototyping RFID Antennas Using Direct-Write. Advanced Packaging, IEEE Transactions, vol.84, pp.345-352, 2000.

P. &. Serra, J. &. Fernández-pradas, M. &. Colina, . Duocastella, &. Martí et al., Laserinduced forward transfer of silver nanoparticle ink: Time-resolved imaging of the jetting dynamics and correlation with the printing quality. Microfluidics and Nanofluidics, Christos & Kalpyris, Ioannis & Serpetzoglou, Efthymis & Zergioti, Ioanna, vol.1, 2006.

A. Delage, N. Delhote, S. Verdeyme, B. Bonnet, and L. Carpentier, Aerosol Jet Printing of Millimeter Wave Transmission Lines on 3D Ceramic Substrates Made by Additive Manufacturing, IEEE Transactions on Components, Packaging and Manufacturing Technology, vol.64, pp.3208-3216, 2016.
URL : https://hal.archives-ouvertes.fr/hal-01840988

Y. He, M. Thomas-craton, P. Chahal, J. Papapolymerou, ;. C. Oakley et al., Ultra wideband 3D interconnects using aerosol jet printing up to 110 GHz, 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), pp.1112-1115, 2017.

M. Abt, Aerosol-Printed Highly Conductive Ag Transmission Lines for Flexible Electronic Devices, IEEE Transactions on Components, Packaging and Manufacturing Technology, vol.8, pp.1838-1844, 2018.

F. Cai, Low-Loss 3-D Multilayer Transmission Lines and Interconnects Fabricated by Additive Manufacturing Technologies, 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC), vol.64, pp.225-228, 1999.

N. Jain, Wideband characterization of multiple bondwires for millimeter-wave applications, IEEE MTT-S International Microwave Symposium Digest (Cat. No.00CH37017), vol.1, pp.1265-1268, 2000.

B. K. Tehrani, B. S. Cook, and M. M. Tentzeris, Inkjet-printed 3D interconnects for millimeter-wave system-on-package solutions, 2016 IEEE MTT-S International Microwave Symposium (IMS), pp.1-4, 2016.

B. K. Tehrani, R. A. Bahr, W. Su, B. S. Cook, M. M. Tentzeris et al., E-band characterization of 3D-printed dielectrics for fully-printed millimeter-wave wireless system packaging, IEEE Transactions on Components, Packaging and Manufacturing Technology, pp.1112-1115, 2017.

C. Oakley, A. Kaur, J. A. Byford, P. T. Chahal-;-m, J. Craton et al., Realization of Fully 3D Printed W-Band Bandpass Filters Using Aerosol Jet Printing Technology, 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), pp.1013-1016, 2017.

H. Kodama, Automatic method for fabricating a three-dimensional plastic model with photo-hardening polymer, Review of Scientific Instruments, vol.52, p.1770, 1981.

A. J. Herbert-;-charles, W. Hull, ;. De-limoges, and E. Doctorale, Alexandre Moussion (16 mars 2018), « CHANEL : son nouveau mascara ouvre la voie à l'industrialisation massive de l'impression 3D, Ludovic CARPENTIER, « Filtres céramiques microondes par stéréolithographie 3D », Electronique des Hautes Fréquences et Optoélectronique, Thèse dirigée par Nicolas DELHOTE et Serge VERDEYME, vol.8, pp.185-188, 1982.

. Terminologie, Techniques de fabrication (Vocabulaires) 25.030 Fabrication additive [I.86] Alkaios Bournias Varotsis, 3D HUBS, Comité technique: ISO/TC 261 Fabrication additive, 2018.

S. A. Schelkunoff-;-s, . P. Schelkunoff-;-c, and . Wen, Coplanar Waveguide: A Surface Strip Transmission Line Suitable for Nonreciprocal Gyromagnetic Device Applications, IEEE Transactions on Microwave Theory and Techniques, vol.34, pp.1087-1090, 1955.

J. D. Coonrod, E. S. Monà, D. C. Sakomura, and . Nascimento, Microstrip-to-Probe Fed Microstrip Antenna Transition, 2018 IEEE International Symposium on Antennas and Propagation & USNC/URSI National Radio Science Meeting, vol.55, pp.1521-1522, 2012.

D. M. Elsheikh, H. A. Elsadek, E. A. Abdallah, S. Atteya, and W. N. Elmazny, Rapid detection of blood entero-viruses using microstrip antenna bio-sensor, 2013 European Microwave Conference, pp.878-880, 2013.

J. Liu, J. Yang, and A. U. Zaman, Study of Dielectric Loss and Conductor Loss among Microstrip, covered Microstrip and inverted Microstrip Gap Waveguide utilizing variational Method in Millimeter Waves, 2018 International Symposium on Antennas and Propagation (ISAP), pp.1-2, 2018.

]. D. Pozar, ;. P. Engineering, A. Rynkiewicz, F. Franc, M. Coccetti et al., Filtres intégrés en anneau à 140 GHz » chez XX èmes Journées Nationales Microondes, 2011.

N. Rainee and . D. Simons-ph, Coplanar Waveguide Circuits, Components, and Systems

M. Riaziat, R. Majidi-ahy, I. -. Feng-;-y-annick, R. Carru, and L. De-lille, Etude et caractérisations microondes en basses températures de résonateurs coplanaires supraconducteurs et de transistors en vue de réaliser des dispositifs microélectroniques », Spécialité : ELECTRONIQUE, sous la direction de Monsieur J, IEEE Transactions on Microwave Theory and Techniques, vol.38, pp.245-251, 1990.

A. Rashidian, M. T. Aligodarz, and D. M. Klymyshyn, Dielectric characterization of materials using a modified microstrip ring resonator technique, IEEE Transactions on Dielectrics and Electrical Insulation, vol.19, issue.4, pp.1392-1399, 2012.

E. Laplanche, Additive manufacturing of low cost and efficient proof of concepts for microwave passive components, IET Microwaves, Antennas & Propagation, vol.11, 1997.

J. M. Vargas, P. Brown, T. Khan, Y. Hijazi, Y. A. Vlasov et al., Superconducting half-wave microwave resonator on YSZ buffered Si, IEEE Transactions on Applied Superconductivity, vol.100, issue.1, pp.392-394, 2001.

T. Yang, P. Chi, and T. Itoh, Compact Quarter-Wave Resonator and Its Applications to

M. Diplexer and . Triplexer, IEEE Transactions on Microwave Theory and Techniques, vol.59, pp.260-269, 2011.

K. Tanii and K. Wada, Wideband Bandpass Filter Composed of Dual-Path Resonators Using Coupled-Line and Transmission Line With Inductive Elements, IEEE Microwave and Wireless Components Letters, vol.24, issue.1, pp.14-16, 2014.

J. Zhu and Z. Feng, Microstrip Interdigital Hairpin Resonator With an Optimal Physical Length, IEEE Microwave and Wireless Components Letters, vol.16, issue.12, pp.672-674, 2006.

M. K. Salleh, M. T. Ali, M. K. Hamzah, and G. Prigent, Series coupled microwave ring resonators, 2011 IEEE International Conference on System Engineering and Technology, pp.125-127, 2011.

D. Deslandes, M. Bozzi, P. Arcioni, and K. Wu, Substrate integrated slab waveguide (SISW) for wideband microwave applications, IEEE MTT-S International Microwave Symposium Digest, vol.2, pp.1103-1106, 2003.

H. Uchimura, T. Takenoshita, and M. Fujii, Development of a "laminated waveguide, IEEE Transactions on Microwave Theory and Techniques, vol.46, pp.2438-2443, 1998.

M. Ando, J. Hirokawa, T. Yamamoto, A. Akiyama, Y. Kimura et al., Novel single-layer waveguides for high-efficiency millimeter-wave arrays, IEEE Transactions on Microwave Theory and Techniques, vol.46, pp.792-799, 1998.

J. -. Heinola, K. -. Latti, and P. Silventoinen, Dielectric characterization of printed wiring board materials: a comparison of ring and T-resonator based measurement methods, CEIDP '05. 2005 Annual Report Conference on Electrical Insulation and Dielectric Phenomena, pp.629-632, 2005.

D. Rajeswart, A. S. Ranjini, S. Thenkuzhali-;-hussain, A. , and «. Ltcc, Design and optimization of various coupling micro strip ring resonators, Electronique des Hautes Fréquences, Photonique et systèmes, Thèse dirigée par Olivier TANTOT et Serge VERDEYME, Faculté des Sciences et Techniques de Limoges, ECOLE DOCTORALE : Sciences et Ingénierie pour l'Information, pp.31-2011, 2017.

P. Guillon and Y. Garault, Complex permittivity measurement of MIC substrate, 1981.

W. Feuray, O. Tantot, E. Sorolla, and N. Delhote, Détermination Non Destructive de la Conductivité Electrique de Dépôts Conducteurs, 14èmes Journées de Caractérisation Microondes et Matériaux (JCMM), mars 2016

K. Chang, L. Hsieh-;-gang, H. Zou, P. Gronqvist, J. Starski et al., Characterization of liquid crystal polymer for high frequency system-in-a-package applications, Proceedings. 8th International Advanced Packaging Materials Symposium (Cat. No.02TH8617), vol.25, pp.503-508, 2002.

J. -. Heinola, P. Silventoinen, K. Latti, M. Kettunen, and J. -. Strom, Determination of dielectric constant and dissipation factor of a printed circuit board material using a microstrip ring resonator structure, 15th International Conference on Microwaves, Radar and Wireless Communications (IEEE Cat. No.04EX824), vol.1, pp.202-205, 2004.

A. A. Gupta, A. Bolduc, S. G. Cloutier, and R. Izquierdo, Aerosol Jet Printing for printed electronics rapid prototyping, 2016 IEEE International Symposium on Circuits and Systems (ISCAS), pp.866-869, 2016.

C. Goth, S. Putzo, and J. Franke, Aerosol Jet printing on rapid prototyping materials for fine pitch electronic applications, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC), pp.1211-1216, 2011.

M. Abt, Aerosol-Printed Highly Conductive Ag Transmission Lines for Flexible Electronic Devices, IEEE Transactions on Components, Packaging and Manufacturing Technology, vol.8, pp.1838-1844, 2018.

. Khorramdel and M. Behnam-&-mäntysalo, Fabrication and electrical characterization of partially metallized vias fabricated by inkjet, Journal of Micromechanics and Microengineering, 2016.

B. Andò and S. Baglio, All-Inkjet Printed Strain Sensors, IEEE Sensors Journal, vol.13, issue.12, pp.4874-4879, 2013.

E. L. Chaimaa, . Hajjaji, G. Julien, L. Souhayl, D. Nicolas et al., Optimizing the Conductivity of Ink-Jet Printed Microwave Components on Polymer Substrates by Laser Sintering, EuMW, 2019.

J. A. Qayyum, M. Abt, A. Roch, A. C. Ulusoy, and J. Papapolymerou, Ultra wideband 3D interconnects using aerosol jet printing up to 110 GHz, 47th European Microwave Conference (EuMC), pp.1112-1115, 2017.

R. Soukup, J. Navratil, J. Reboun, and T. Rericha, A comparison of the interdigital electrodes prepared by aerosol jet printing and lift-off technique, 38th International Spring Seminar on Electronics Technology (ISSE), pp.30-35, 2015.

B. K. Tehrani, J. Bito, B. S. Cook, and M. M. Tentzeris, Fully inkjet-printed multilayer microstrip and T-resonator structures for the RF characterization of printable materials and interconnects, 2014 IEEE MTT-S International Microwave Symposium (IMS2014), pp.1-4, 2014.

F. Cai, Y. Chang, K. Wang, C. Zhang, B. Wang et al., Low-Loss 3-D Multilayer Transmission Lines and Interconnects Fabricated by Additive Manufacturing Technologies, IEEE Transactions on Microwave Theory and Techniques, vol.64, pp.3208-3216, 2016.

F. Cai, Y. Chang, K. Wang, W. T. Khan, S. Pavlidis et al., High resolution aerosol jet printing of D-band printed transmission lines on flexible LCP substrate, 2014 IEEE MTT-S International Microwave Symposium (IMS2014), pp.1-3, 2014.

F. Cai, Aerosol jet printing for 3-D multilayer passive microwave circuitry, p.44, 2014.

R. European-microwave-conference, , pp.512-515, 2014.

J. Hoerber, C. Goth, J. Franke, and M. Hedges, Electrical functionalization of thermoplastic materials by Aerosol Jet Printing, 2011 IEEE 13th Electronics Packaging Technology Conference, pp.813-818, 2011.

T. Tokusen-;-bakhishev and V. Subramanian, Consulté sur, vol.38, p.2720, 2009.

W. Cui, . Lu, &. Wensheng, . Zhang, &. Yakun et al.,

, Gold nanoparticle ink suitable for electric-conductive pattern fabrication using in ink-jet printing technology, Colloids and Surfaces A: Physicochemical and Engineering Aspects, vol.358, pp.35-41

Y. Wu, . Li, &. Yuning, P. &. Liu, S. &. Gardner et al., Studies of Gold Nanoparticles as Precursors to Printed Conductive Features for Thin-Film Transistors, Chemistry of Materials -CHEM MATER, 2006.

K. Wang and J. Stark, Deposition of colloidal gold nanoparticles by fully pulsedvoltage-controlled electrohydrodynamic atomisation, Journal of Nanoparticle Research, 2010.

M. T. Craton, J. D. Albrecht, P. Chahal, and J. Papapolymerou, A Chip-First Approach to Millimeter-Wave Circuit Packaging, IEEE Microwave and Wireless Components Letters, vol.29, issue.2, pp.116-118, 2019.

I. Piekarz, J. Sorocki, M. T. Craton, K. Wincza, S. Gruszczynski et al., Application of Aerosol Jet 3-D Printing With Conductive and Nonconductive Inks for Manufacturing mm-Wave Circuits, IEEE Transactions on Components, Packaging and Manufacturing Technology, vol.9, pp.586-595, 2019.

J. A. Qayyum, M. Abt, A. Roch, A. C. Ulusoy, and J. Papapolymerou, Ultra wideband 3D interconnects using aerosol jet printing up to 110 GHz, 12th European Microwave Integrated Circuits Conference (EuMIC), pp.372-375, 2017.

M. M. Belhaj, W. Wei, E. Pallecchi, C. Mismer, I. Roch-jeune et al., Inkjet printed flexible transmission lines for high frequency applications up to 67 GHz, 9th European Microwave Integrated Circuit Conference, pp.584-587, 2014.

Y. He, RF characterization of coplanar waveguide (CPW) transmission lines on singlecrystalline diamond platform for integrated high power RF electronic systems, 2017 IEEE MTT-S International Microwave Symposium (IMS), Honololu, HI, pp.517-520, 2017.

M. Akbari, L. Sydänheimo, J. Juuti, and L. Ukkonen, Flash reduction of inkjet printed graphene oxide on flexible substrates for electronic applications, IEEE 15th International Conference on Nanotechnology, pp.93-96, 2015.

L. T. Le, M. H. Ervin, H. Qiu, B. E. Fuchs, J. Zunino et al., Inkjet-printed graphene for flexible micro-supercapacitors, 11th IEEE International Conference on Nanotechnology, pp.67-71, 2011.

H. He, M. Akbari, L. Sydänheimo, L. Ukkonen, and J. Virkki, 3D-printed graphene and stretchable antennas for wearable RFID applications, 2017 International Symposium on Antennas and Propagation (ISAP), pp.1-2, 2017.

W. Jiang, Y. Jin, T. Wang, Y. Huang, and G. Wang, 3-D printed X-band Yagi-Uda antenna, IEEE Radio and Wireless Symposium (RWS), pp.290-292, 2018.

V. Fakhfouri, Inkjet printing of SU-8 for polymer-based MEMS a case study for microlenses, IEEE 21st International Conference on Micro Electro Mechanical Systems, pp.407-410, 2008.

H. Kao, C. Cho-;-he, M. Yuxiao, P. Thomas-craton, J. Chahal et al., A Bi-material Fully Aerosol Jet printed W-band Quasi-Yagi-Uda Antenna, Fully Inkjet-Printed Three-Dimensional Bandpass Filter on Liquid Crystal Polymer Substrate, pp.1-3, 2018.

M. T. Craton, J. D. Albrecht, P. Chahal, J. Papapolymerou, . Dupont et al., A Chip-First Approach to Millimeter-Wave Circuit Packaging, IEEE Microwave and Wireless Components Letters, vol.29, issue.2, pp.116-118, 2017.

. Swvb00qfjabegqicrac&url=https%3a%2f%2fwww and . Dupont, com%2Fcontent%2Fdam%2Fdupont%2Fproduct s-and-services%2Fmembranes-and-films%2Fpolyimde-films%2Fdocuments%2FDEC-Kapton-summary-ofproperties

, Références bibliographiques Chapitre III

A. H. Khalil, Full-3D printed electronics process using stereolitography and electroless plating, 2017 32nd Conference on Design of Circuits and Integrated Systems (DCIS), pp.1-4, 2011.

B. K. Tehrani, R. A. Bahr, W. Su, B. S. Cook, M. M. Tentzeris et al., Low-Loss 3-D Multilayer Transmission Lines and Interconnects Fabricated by Additive Manufacturing Technologies, 2017 IEEE MTT-S International Microwave Symposium (IMS), Honololu, HI, vol.64, pp.3208-3216, 2015.

M. Khalil and D. H. Khalil, 3-D pyramidal and collective Ku band pass filters made in Alumina by ceramic stereolithography, Composants céramiques 3D innovants pour des applications spatiales de télécommunications millimétriques en bandes Q et V », pp.1-4, 2011.
URL : https://hal.archives-ouvertes.fr/hal-00683584

E. Laplanche, Additive manufacturing of low cost and efficient proof of concepts for microwave passive components, IET Microwaves, Antennas & Propagation, vol.11, 1997.

C. Kwak, M. Uhm, I. Yom, and H. J. Eom, Automated Microwave Filter Tuning Using Curve Similarity and Weighted Least Squares, IEEE Microwave and Wireless Components Letters, vol.22, issue.10, pp.539-541, 2012.

M. Brumos, V. E. Boria, M. Guglielmi, S. Cogollos-;-faten, M. Kouki et al., Correction of manufacturing deviations in circular-waveguide dual-mode filters using aggressive space mapping, IEEE Microwave and Wireless Components Letters, vol.23, pp.3715-3721, 2009.

N. J. Parker, S. W. Goodyear, D. Ellis, R. G. Humphreys-;-a, A. E. Atia et al., Wide-band dielectric filter at C-band manufactured by stereolithography, IEEE Transactions on Microwave Theory and Techniques, vol.20, pp.187-190, 1972.

A. Périgaud, Conception de banques de filtres micro-ondes passifs compacts dans la bande 2-20 GHz à l'aide des technologies multicouches, Hautes Références bibliographiques Chapitre IV

S. Li, M. Yi, S. Pavlidis, H. Yu, M. Swaminathan et al., Low-Loss 3-D Multilayer Transmission Lines and Interconnects Fabricated by Additive Manufacturing Technologies, Investigation of surface roughness effects for D-band SIW transmission lines on LCP substrate, vol.6, pp.119-122, 2000.

H. T. Hai, K. Lee, D. Ando, Y. Sutou, M. Koyanagi et al., Feasibility study of Cu paste printing technique to fill deep via holes for low cost 3D TSV applications, IEEE International Interconnect Technology Conference (IITC), pp.1-3, 2017.

I. Reinhold, M. Thielen, W. Voit, W. Zapka, R. Götzen et al., Inkjet printing of electrical vias, 18th European Microelectronics & Packaging Conference, pp.1-4, 2011.

M. Kujala, T. Kololuoma, J. Keskinen, D. Lupo, M. Mäntysalo et al., Fabrication of Fully Inkjet-Printed Vias and SIW Structures on Thick Polymer Substrates, IEEE Transactions on Components, Packaging and Manufacturing Technology, vol.6, pp.486-496, 2016.

F. Cai, Aerosol jet printing for 3-D multilayer passive microwave circuitry, p.44, 2014.

R. European-microwave-conference, , pp.512-515, 2014.

A. Sain and K. L. Melde, Impact of Ground via Placement in Grounded Coplanar Waveguide Interconnects, IEEE Transactions on Components, Packaging and Manufacturing Technology, vol.6, pp.136-144, 2016.

A. Delage, N. Delhote, S. Verdeyme, B. Bonnet, L. Carpentier et al., Aerosol Jet Printing of Millimeter Wave Transmission Lines on 3D Ceramic Substrates Made by Additive Manufacturing, International Microwave Symposium (IMS 2018), 2018.
URL : https://hal.archives-ouvertes.fr/hal-01840988

Y. Pan, Comparing the copper and gold wire bonding during thermalsonic wire bonding process, 17th International Conference on Electronic Packaging Technology (ICEPT), pp.240-243, 2016.

D. An, X. Li, J. Mou, and X. Lv, Modeling and Characteristic of the Vertical Bonding-Wire Interconnection in Ka-band, Global Symposium on Millimeter Waves, pp.229-232, 2008.

Q. Zeng, Y. Guan, J. Chen, and Y. Jin, Low-Temperature Ultrasonic Bonding of Cu/Sn Microbumps with Au Layer for High Density Interconnection Applications, 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), pp.1894-1899, 2017.

A. Inmann, D. Hodgins, ;. Y. Zhang, and D. Liu, Antenna-on-Chip and Antenna-in-Package Solutions to Highly Integrated Millimeter-Wave Devices for Wireless Communications, IEEE Transactions on Antennas and Propagation, vol.544, issue.10, pp.2830-2841, 2009.

W. Heinrich, A. Jentzsch, G. Baumann-;-n.-quack, J. Sadie, V. Subramanian et al., Millimeter-wave characteristics of flip-chip interconnects for multichip modules, Through Silicon Vias and thermocompression bonding using inkjet-printed gold nanoparticles for heterogeneous MEMS integration, vol.46, pp.2264-2268, 1998.

X. Transducers-&-eurosensors, The 17th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII), pp.834-837, 2013.

T. Falat, J. Felba, A. Moscicki, and J. Borecki, Nano-silver inkjet printed interconnections through the microvias for flexible electronics, 11th IEEE International Conference on Nanotechnology, pp.473-477, 2011.

S. Stoukatch, Evaluation of Aerosol Jet Printing (AJP) technology for electronic packaging and interconnect technique, 2012 4th Electronic System-Integration Technology Conference, pp.1-5, 2012.

A. A. Gupta, M. C. Soer, M. Taherzadeh-sani, S. G. Cloutier, and R. Izquierdo, Aerosol-Jet Printed Transmission Lines for Microwave Packaging Applications, IEEE Transactions on Components, Packaging and Manufacturing Technology

J. Sence, W. Feuray, A. Perigaud, O. Tantot, and N. Delhote, Plastic and metal additive manufacturing technologies for microwave passive components up to Ka band, International Journal of Microwave and Wireless Technologies, pp.1-11, 2018.
URL : https://hal.archives-ouvertes.fr/hal-01777556

D. Sette, A. Blayo, C. Poulain, D. Mercier, ;. S. Yang et al., Fully Inkjet Printed 85GHz Band Pass Filter on Flexible Substrate, 2013 IEEE MTT-S International Microwave Symposium Digest (MTT), pp.652-654, 2013.

C. Tomassoni, R. Bahr, M. Tentzeris, M. Bozzi, and L. Perregrini, 3D printed substrate integrated waveguide filters with locally controlled dielectric permittivity, pp.253-256, 2016.

G. L. Matthaei, Interdigital Band-Pass Filters, IRE Transactions on Microwave Theory and Techniques, vol.10, pp.479-491, 1962.

R. J. Wenzel, Exact Theory of Interdigital Band-Pass Filters and Related Coupled Band-Pass Structures, IEEE Transactions on Microwave Theory and Techniques, vol.13, pp.559-575, 1965.

D. Deslandes and K. Wu, Accurate modeling, wave mechanisms, and design considerations of a substrate integrated waveguide, IEEE Transactions on Microwave Theory and Techniques, vol.54, pp.2516-2526, 2006.

, Annexe 2

, Références bibliographiques Annexes

E. 3d-matter's-hub-;-imprimante3d, F. Schéma, L. Wikipédia, ;. F. 'encyclopédie-libre, and . Kouki, MAKERSHOP3D Expert en Impression 3D, « Guide d'achat des résines SLA d'impression 3D », TOP 10 des filaments pour imprimantes 3D les plus insolites ! », vol.24, pp.1588-1591, 2014.

A. M. , La technologie CLIP devrait révolutionner l'impression 3D ! », vol.18

«. Sculpteo, impression 3D avec l'imprimante 3D Carbon et la technologie CLIP

, Carbon3D dévoile « M1 » sa première imprimante 3D commerciale

S. Iska-hain, Carbon and Automobili Lamborghini Partner to Digitally Manufacture Auto Parts at Scale

S. Iska-hain, Carbon® to Produce First-Ever 3D Printed Football Helmet Liner

, BEAMIT metal additive manufacturing, Technologie SLS pour l'impression 3D de plastique »

T. &. Moritz and S. Maleksaeedi, Additive manufacturing of ceramic components, 2018.

M. Leary, Surface roughness optimisation for selective laser melting (SLM): Accommodating relevant and irrelevant surfaces, Laser Additive Manufacturing Materials, Design, Technologies, and Applications, pp.99-118, 2017.

J. Kerns, What's the Difference Between Stereolithography and Selective Laser Sintering?, 2015.

E. Arcam, EBM-Built Materials-way beyond average

R. &. Lancaster, . Davies, &. Gareth, H. &. Illsley, S. P. Jeffs et al., Éliminer les obstacles freinant l'adoption de l'impression 3D grâce à l'innovation des matériaux. », Structural Integrity of an Electron Beam Melted Titanium Alloy. Materials. 9, vol.2, 2016.

, Alkaios Bournias Varotsis, 3D HUBS, « Introduction to Binder Jetting 3D printing

K. Consulté-sur-;-pragnya-kunchala and . Kappagantula, 3D printing high density ceramics using binder jetting with nanoparticle densifiers, Materials & Design, vol.155, 2018.

M. Prechtl, A. &. Otto, and M. Geiger, Beyond compare, long-Fiber Makes our Composites Stronger, Lighter, Tougher. So, Why Mess Around with Anything Less?, Advanced Materials Research, 2005.

B. Jackson and . Industry, LENS® Composites and Ceramics, A wide variety of composites and ceramic materials can be processed using LENS technology, Impossible Objects raises $6.4 million in series A funding for composite 3D printer development, 2018.

P. Zelinski, The Possibilities of Electron Beam Additive Manufacturing

S. Oliari, A. Oliveira, . Sofia, and M. Schulz, Additive Manufacturing of H11 with Wire-Based Laser Metal Deposition, 2017.

S. Oliari, A. Oliveira, . Sofia, and M. Schulz, Additive Manufacturing of H11 with Wire-Based Laser Metal Deposition. Soldagem & Inspeção, 2017.