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hal-00874666v1  Communication dans un congrès
Khalil El Falahi, Stanislas Hascoët, Cyril Buttay, Pascal Bevilacqua, Luong Viet Phung et al.  High temperature, Smart Power Module for aircraft actuators
HiTEN'13, Jul 2013, Oxford, United Kingdom. 2013
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hal-00672240v1  Article dans une revue
Elias Haddad, Christian Martin, Charles Joubert, Bruno Allard, Maher Soueidan et al.  Modeling, Fabrication, and Characterization of Planar Inductors on YIG Substrates
Advanced Materials Research, Trans Tech Publications, 2011, 324, pp.294-297. <10.4028/www.scientific.net/AMR.324.294>
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hal-00413349v1  Communication dans un congrès
Cyril Buttay, Dominique Planson, Bruno Allard, Dominique Bergogne, Pascal Bevilacqua et al.  State of the art of High Temperature Power Electronics
Microtherm, Jun 2009, Lodz, Poland. pp.8-17, 2009
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hal-01372146v1  Communication dans un congrès
Bruno Allard, Cyril Buttay, Céline Martin, Hervé Morel. Considerations for High Temperature Power Electronics
18th International Symposium on Power Electronics Ee2015, Oct 2015, Novi Sad, Serbia
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hal-01372141v1  Communication dans un congrès
Remi Perrin, Bruno Allard, Cyril Buttay, Nicolas Quentin, Wenli Zhang et al.  2 MHz high-density integrated power supply for gate driver in high-temperature applications
Applied Power Electronics Conference and Exposition (APEC), Mar 2016, Long Beach, United States. Applied Power Electronics Conference and Exposition (APEC), 2016 IEEE, 2016, <10.1109/APEC.2016.7467922>
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hal-00799884v1  Article dans une revue
Rémy Ouaida, Cyril Buttay, Anh Dung Hoang, Raphaël Riva, Dominique Bergogne et al.  Thermal Runaway Robustness of SiC VJFETs
Materials Science Forum, Trans Tech Publications Inc., 2013, 740-742, pp.929-933. <10.4028/www.scientific.net/MSF.740-742.929>
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hal-00687139v1  Communication dans un congrès
Bruno Allard, Cyril Buttay, Dominique Tournier, Rémi Robutel, Jean-François Mogniotte et al.  Higher temperature power electronics for larger-scale mechatronic integration
Automotive Power Electronics, Apr 2011, Paris, France. Actes sur CD (pas de pagination), 2011
hal-01188561v1  Communication dans un congrès
Anne-Sophie Podlejski, Arnaud Bréard, Cyril Buttay, Eliana Rondon-Pinilla, Florent Morel et al.  Layout modelling to predict compliance with EMC standards of power electronic converters
EMC 2015, Aug 2015, Dresden, Germany. pp.779-784, 2015, Proc. of the IEEE International Symposium on Electromagnetic Compatibility
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tel-01267363v1  HDR
Cyril Buttay. Le Packaging en électronique de puissance
Sciences de l'ingénieur [physics]. INSA de lyon, 2015
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hal-00672602v1  Communication dans un congrès
Amandine Masson, Cyril Buttay, Hervé Morel, Christophe Raynaud, Stanislas Hascoët et al.  High-temperature die-attaches for SiC power devices
EPE, Aug 2011, Birmingham, United Kingdom. pp.Article number 6020161, 2011
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hal-01207014v1  Article dans une revue
Bassem Mouawad, Benoit Thollin, Cyril Buttay, Laurent Dupont, Vincent Bley et al.  Direct Copper Bonding for Power Interconnects: Design, Manufacturing, and Test
Components, Packaging and Manufacturing Technology, IEEE Transactions on, 2015, 5 (1), pp.143-150. <http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6983597>
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hal-01196527v1  Communication dans un congrès
Chenjiang Yu, Éric Labouré, Cyril Buttay. Thermal management of lateral GaN power devices
International Workshop on Integrated Power Packaging (IWIPP), May 2015, Chicago, United States. IEEE, 2015, Proceedings of the International Workshop on Integrated Power Packaging
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hal-00138878v1  Article dans une revue
Cyril Buttay, Hervé Morel, Bruno Allard, Pierre Lefranc, Olivier Brevet. Model Requirements for Simulation of Low-Voltage MOSFET in Automotive Applications
IEEE Transactions on Power Electronics, Institute of Electrical and Electronics Engineers, 2006, 21 (3), pp.613-624. <10.1109/TPEL.2006.872383>
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hal-00874465v1  Article dans une revue
Amandine Masson, Wissam Sabbah, Raphaël Riva, Cyril Buttay, Stephane Azzopardi et al.  Die attach using silver sintering. Practical implementation and analysis
European Journal of Electrical Engineering, Lavoisier, 2013, 16 (3-4), pp.293-305. <10.3166/ejee.16.293-305>
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hal-00672440v1  Article dans une revue
Cyril Buttay, Christophe Raynaud, Hervé Morel, Gabriel Civrac, Marie-Laure Locatelli et al.  Thermal stability of silicon-carbide power diodes
IEEE Transactions on Electron Devices, Institute of Electrical and Electronics Engineers, 2012, 59 (3), pp.761-769. <10.1109/TED.2011.2181390>
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hal-00672244v1  Article dans une revue
Bassem Mouawad, Maher Soueidan, Damien Fabrègue, Cyril Buttay, Bruno Allard et al.  Application of the Spark Plasma Sintering Technique to Low-Temperature Copper Bonding
IEEE Transactions on Components and Packaging Technologies, Institute of Electrical and Electronics Engineers, 2012, 2 (4), pp.553 - 560. <10.1109/TCPMT.2012.2186453>
hal-00597432v1  Article dans une revue
Cyril Buttay, Dominique Planson, Bruno Allard, Dominique Bergogne, Pascal Bevilacqua et al.  State of the art of high temperature power electronics
Materials Science and Engineering: B, Elsevier, 2011, 176 (4), pp.283-288. <10.1016/j.mseb.2010.10.003>
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hal-01373065v1  Article dans une revue
Chenjiang Yu, Cyril Buttay, Eric Labouré. Thermal management and electromagnetic analysis for GaN devices packaging on DBC substrate
IEEE Transactions on Power Electronics, Institute of Electrical and Electronics Engineers, 2016, 32 (2), pp. 906 - 910. <10.1109/TPEL.2016.2585658>
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hal-00874458v1  Article dans une revue
Raphaël Riva, Cyril Buttay, Bruno Allard, Pascal Bevilacqua. Migration issues in sintered-silver die attaches operating at high temperature
Microelectronics Reliability, Elsevier, 2013, 53 (9-11), pp.1592-1596. <10.1016/j.microrel.2013.07.103>

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