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hal-01374141v1  Article dans une revue
Rémi PerrinNicolas QuentinBruno AllardChristian MartinMarwan AliHigh-Temperature GaN Active-Clamp Flyback Converter With Resonant Operation Mode
IEEE Journal of Emerging and Selected Topics in Power Electronics, 2016, 4 (3), pp.1077 - 1085. <10.1109/JESTPE.2016.2544346>
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hal-00874666v1  Communication dans un congrès
Khalil El FalahiStanislas HascoëtCyril ButtayPascal BevilacquaLuong Viet Phung et al.  High temperature, Smart Power Module for aircraft actuators
HiTEN'13, Jul 2013, Oxford, United Kingdom. 2013
hal-00476272v1  Communication dans un congrès
Malal BathilyBruno AllardJ. VerdierFrédéric HasbaniResonant gate drive for silicon integrated DC/DC converters
ECCE, Sep 2009, San Jose, CA, United States. pp.3876 - 3880, 2009, <10.1109/ECCE.2009.5316115>
hal-00358864v1  Article dans une revue
Kaiçar AmmousBruno AllardHatem GarrabAnis AmmousLosses evaluation in converters using the calorimetric technique
Journal of Thermal Analysis and Calorimetry, Springer Verlag (Germany), 2007, 90 (1), pp.307-314. <10.1007/s10973-006-7521-6>
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hal-01191419v1  Communication dans un congrès
Rémi PerrinDominique BergogneChristian MartinBruno AllardGaN Power Module with High Temperature Gate Driver and Insulated Power Supply
IMAPS International Conference and Exhibition on High Temperature Electronics (HITEC), May 2014, Albuquerque, United States. 2014
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hal-00413349v1  Communication dans un congrès
Cyril ButtayDominique PlansonBruno AllardDominique BergognePascal Bevilacqua et al.  State of the art of High Temperature Power Electronics
Microtherm, Jun 2009, Lodz, Poland. pp.8-17, 2009
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hal-01372146v1  Communication dans un congrès
Bruno AllardCyril ButtayCéline MartinHervé MorelConsiderations for High Temperature Power Electronics
18th International Symposium on Power Electronics Ee2015, Oct 2015, Novi Sad, Serbia
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hal-01372141v1  Communication dans un congrès
Remi PerrinBruno AllardCyril ButtayNicolas QuentinWenli Zhang et al.  2 MHz high-density integrated power supply for gate driver in high-temperature applications
Applied Power Electronics Conference and Exposition (APEC), Mar 2016, Long Beach, United States. Applied Power Electronics Conference and Exposition (APEC), 2016 IEEE, 2016, <10.1109/APEC.2016.7467922>
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hal-00687139v1  Communication dans un congrès
Bruno AllardCyril ButtayDominique TournierRémi RobutelJean-François Mogniotte et al.  Higher temperature power electronics for larger-scale mechatronic integration
Automotive Power Electronics, Apr 2011, Paris, France. Actes sur CD (pas de pagination), 2011
hal-00140112v1  Article dans une revue
Anis AmmousFayçal SellamiKaiçar AmmousHervé MorelBruno Allard et al.  Developing an equivalent thermal model for discrete semiconductor packages
International Journal of Thermal Sciences, Elsevier, 2003, 42 (5), pp.533-539
hal-00658824v1  Communication dans un congrès
Vlad MarianChristian VollaireBruno AllardJacques VerdierLow power rectenna topologies for medium range wireless energy transfer
EPE, Aug 2011, Birmingham, United Kingdom. IEEE, pp.CD, 2011
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hal-01348475v1  Communication dans un congrès
A CapitaineGaël PillonnetT ChaillouxF KhaledO Ondel et al.  Loss analysis of Flyback in Discontinuous Conduction Mode for sub-mW harvesting systems
14th IEEE International New Circuits and Systems Conference (NEWCAS 2016), Jun 2016, Vancouver, Canada. <http://newcas2016.ieee.ca/>
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hal-00476271v1  Article dans une revue
Ludovic MénagerMaher SoueidanBruno AllardVincent BleyBenoît SchlegelA Lab-Scale Alternative Interconnection Solution of Semiconductor Dice Compatible with Power Modules 3-D Integration
IEEE Transactions on Power Electronics, Institute of Electrical and Electronics Engineers, 2010, 25 (7), pp.1667 - 1670. <10.1109/TPEL.2010.2041557>
hal-00661407v1  Article dans une revue
Malal BathilyBruno AllardFrédéric HasbaniVincent PinonJacques VerdierDesign Flow for High Switching Frequency and Large-Bandwidth Analog DC/DC Step-Down Converters for a Polar Transmitter
IEEE Transactions on Power Electronics, Institute of Electrical and Electronics Engineers, 2011, 27 (2), pp.838 - 847. <10.1109/TPEL.2011.2158659>
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hal-00138878v1  Article dans une revue
Cyril ButtayHervé MorelBruno AllardPierre LefrancOlivier BrevetModel Requirements for Simulation of Low-Voltage MOSFET in Automotive Applications
IEEE Transactions on Power Electronics, Institute of Electrical and Electronics Engineers, 2006, 21 (3), pp.613-624. <10.1109/TPEL.2006.872383>
hal-00811919v1  Article dans une revue
Xavier BrancaBruno AllardXuefang Lin-ShiDavid ChesneauSingle-Inductor Bipolar-Outputs Converter for the Supply of Audio Amplifiers in Mobile Platforms
IEEE Transactions on Power Electronics, Institute of Electrical and Electronics Engineers, 2013, 28 (9), pp.4248 - 4259. <10.1109/TPEL.2013.2238252>
hal-00811916v1  Article dans une revue
Benoît LabbeBruno AllardXuefang Lin-ShiDavid ChesneauAn Integrated Sliding-Mode Buck Converter With Switching Frequency Control for Battery-Powered Applications
IEEE Transactions on Power Electronics, Institute of Electrical and Electronics Engineers, 2013, 28 (9), pp.4318 - 4326. <10.1109/TPEL.2012.2226754>
hal-00140094v1  Article dans une revue
Xuefang Lin-ShiJean-Marie RétifBruno AllardHervé MorelNon-linear control design for a boost converter using bond graphs
Proceedings of the Institution of Mechanical Engineers, Part I: Journal of Systems and Control Engineering, SAGE Publications, 2002, 216 (I1), pp.1-11
hal-01388381v1  Article dans une revue
Rony IbrahimDamien VoyerArnaud BreardJulien HuilleryChristian Vollaire et al.  Experiments of Time-Reversed Pulse Waves for Wireless Power Transmission in an Indoor Environment
IEEE Transactions on Microwave Theory and Techniques, Institute of Electrical and Electronics Engineers, 2016, 64 (7), pp.2159 - 2170. <10.1109/TMTT.2016.2572679>
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hal-00140095v1  Article dans une revue
Nouri MassmoudiDjébé M'BaïriBruno AllardHervé MorelOn the validity of the standard SPICE model of the diode for simulation in power electronics
IEEE Transactions on Industrial Electronics, Institute of Electrical and Electronics Engineers, 2001, 48 (4), pp.864-867
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hal-00672244v1  Article dans une revue
Bassem MouawadMaher SoueidanDamien FabrègueCyril ButtayBruno Allard et al.  Application of the Spark Plasma Sintering Technique to Low-Temperature Copper Bonding
IEEE Transactions on Components and Packaging Technologies, Institute of Electrical and Electronics Engineers, 2012, 2 (4), pp.553 - 560. <10.1109/TCPMT.2012.2186453>
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