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hal-00862617v1  Communication dans un congrès
Mohammad TabbakhFlorent MorelRoberto MradYoussef ZaatarHigh Frequency Battery Impedance Measurements for EMI Prediction
EMC, Aug 2013, Denver, United States. pp.763-767, 2013
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hal-00799884v1  Article dans une revue
Rémy OuaidaCyril ButtayAnh Dung HoangRaphaël RivaDominique Bergogne et al.  Thermal Runaway Robustness of SiC VJFETs
Materials Science Forum, Trans Tech Publications Inc., 2013, 740-742, pp.929-933. <10.4028/www.scientific.net/MSF.740-742.929>
hal-01188561v1  Communication dans un congrès
Anne-Sophie PodlejskiArnaud BréardCyril ButtayEliana Rondon-PinillaFlorent Morel et al.  Layout modelling to predict compliance with EMC standards of power electronic converters
EMC 2015, Aug 2015, Dresden, Germany. pp.779-784, 2015, Proc. of the IEEE International Symposium on Electromagnetic Compatibility
hal-01535727v1  Communication dans un congrès
Rémy CaillaudCyril ButtayJohan Le LesleFlorent MorelRoberto Mrad et al.  High power PCB-embedded inductors based on ferrite powder
5th Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum (MiNaPAD 2017, May 2017, Grenoble, France. 2017
hal-00869995v1  Article dans une revue
Daniela Wolter FerreiraRuth SabariegoLuiz LebensztajnLaurent KrähenbühlFlorent Morel et al.  Homogenization Methods in Simulations of Transcutaneous Energy Transmitters
IEEE Transactions on Magnetics, Institute of Electrical and Electronics Engineers, 2014, 50 (2), pp.7025204. <10.1109/TMAG.2013.2284891>
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hal-00291671v1  Article dans une revue
Florent MorelJean-Marie RétifXuefang Lin-ShiClaire ValentinPermanent Magnet Synchronous Machine Hybrid Torque Control
IEEE Transactions on Industrial Electronics, Institute of Electrical and Electronics Engineers, 2008, 55 (2), pp.501-511. <10.1109/TIE.2007.911938>
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hal-00672440v1  Article dans une revue
Cyril ButtayChristophe RaynaudHervé MorelGabriel CivracMarie-Laure Locatelli et al.  Thermal stability of silicon-carbide power diodes
IEEE Transactions on Electron Devices, Institute of Electrical and Electronics Engineers, 2012, 59 (3), pp.761-769. <10.1109/TED.2011.2181390>