Porous 3D Cu structures with adaptive heat dissipation properties

Jean-François Silvain (1, 2) , Helies Boumali (1) , Julie Bourret (3) , Pierre-Marie Geffroy (3) , Sébastien Fourcade (1) , Thomas Batigne (4) , Karim Sinno (4) , Yongfeng Lu (2) , Loic Constantin (1, 2)

1 ICMCB - Institut de Chimie de la Matière Condensée de Bordeaux
2 Department of Electrical and Computer Engineering
3 IRCER - Institut de Recherche sur les CERamiques
4 Lynxter

This study focuses on the formulation of copper paste with optimal properties to micro-extrude porous Cu heat sinks, using extrusion additive manufacturing. The influence of the debinding and sintering conditions on the porosity level and the heat dissipation behavior has been investigated. Open air debinding leads to a density increases from 200 up to 400°C, then decreases from 400 down to 600°C. This behavior is a result from a competition between densification and the oxidation. Heat dissipation of the copper heat sink increases with respect to the porosity ratio of the sintered part.

Mots clés: 3D printing; Cu; debinding; sintering; Additive manufacturing; thermal conductivity

Domaines: Matériaux

Jean-François Silvain, Helies Boumali, Julie Bourret, Pierre-Marie Geffroy, Sébastien Fourcade, et al.. Porous 3D Cu structures with adaptive heat dissipation properties. MRS Communications, 2022, 12, pp.753-758. ⟨10.1557/s43579-022-00224-2⟩. ⟨hal-03761379⟩