Evaluation of direct printed heat sinks on metallized ceramic substrate for high-performance power modules
Résumé
In this article, we propose a new packaging technology
enabling the development of a high-performance power
module for harsh environments. This approach is based on the
use of the selective laser melting (SLM) technique in order
to directly print metal heat sinks on the backside of the
metallized substrate. In order to explore the viability of this method, the assembled parts were evaluated thoroughly after the manufacturing process. Moreover, their robustness was assessed during aging under harsh conditions. Results show that the ultimate tensile strength and yield strength of the printed alloy are higher than the casted AlSi7Mg0.6 counterpart. The interfaces between the printed alloy and the substrate Al metal layer do not show any weaknesses, and shear stress values are higher than 100 MPa. For all heat sink patterns, the substrate warpage is reduced during thermal cycling due to the Al alloy creeping, while the highly curved substrates show cracks in the ceramic
after 400 cycles. Accordingly, direct printing of heat sink with patterns based on fins array reveals a promising path for highreliability, high-performance power module packaging.
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