A comparison of pad metallization in miniaturized microfabricated silicon microcantilever-based wafer probes for low contact force low skate on-wafer measurements

Khadim Daffe (1) , Jaouad Marzouk (1) , Christophe Boyaval (1, 2) , Gilles Dambrine (1, 3) , Kamel Haddadi (1, 4) , S. Arscott (1, 5)

1 IEMN - Institut d’Électronique, de Microélectronique et de Nanotechnologie - UMR 8520
2 CMNF - IEMN - Centrale de Micro Nano Fabrication - IEMN
3 ANODE - IEMN - Advanced NanOmeter DEvices - IEMN
4 CSAM - IEMN - Circuits Systèmes Applications des Micro-ondes - IEMN
5 NAM6 - IEMN - Nano and Microsystems - IEMN

Miniaturized, microfabricated microelectromechanical systems (MEMS)-based wafer probes are used here to evaluate different contact pad metallization at low tip forces (1000 Nm-1) and small contact pads enabled us to show that it is the length of the pad (in contact with the surface) which determines the contact resistivity rather than the total contact pad area.

Domaines: Sciences de l'ingénieur [physics]

Khadim Daffe, Jaouad Marzouk, Christophe Boyaval, Gilles Dambrine, Kamel Haddadi, et al.. A comparison of pad metallization in miniaturized microfabricated silicon microcantilever-based wafer probes for low contact force low skate on-wafer measurements. Journal of Micromechanics and Microengineering, 2022, 32 (1), pp.015007. ⟨10.1088/1361-6439/ac3cd7⟩. ⟨hal-03449369⟩