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Modeling and Experimental Characterization of Bonding Delaminations in Single-Element Ultrasonic Transducer

Abstract : Ultrasonic transducers performance can be seriously deteriorated by loss of adhesion between some constitutive elements such as the active element, the backing, or the matching layer. In the present work, the influence of bonding delaminations on the performance of a single-element ultrasonic transducer, which is composed of a piezoelectric disk, a backing, and a matching layer, is studied numerically and experimentally. Based on the positions between layers, two cases, i.e., delaminations between ceramic and backing or between ceramic and matching layer, are considered. Each case involves three different types of delaminations, which are marked as delamination type (DT)-I, II, and III. DT-I, a circular shape delamination, starts from the center and expands towards the peripheric zone; DT-II, an annular shape delamination, starts from the peripheric zone and expands towards the center; DT-III is a sector shape delamination with a given angle. The numerical simulations are performed by the finite element method and the influence of delaminations on the electromechanical admittance (EMA) of the transducer is investigated. 3D printed backings and matching layers are mounted on a PZT sample to assemble delaminated single-element transducers. An impedance analyzer is used for experimental measurements. Comparison between numerical and experimental results shows a reasonable agreement making changes in EMA an interesting indicator to inform about the occurrence and severity of delaminations in a single-element ultrasonic transducer.
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https://hal.archives-ouvertes.fr/hal-03379798
Contributor : Wenxiang Ding Connect in order to contact the contributor
Submitted on : Friday, October 15, 2021 - 11:00:36 AM
Last modification on : Friday, April 1, 2022 - 3:48:42 AM

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Wenxiang Ding, Maxime Bavencoffe, Marc Lethiecq. Modeling and Experimental Characterization of Bonding Delaminations in Single-Element Ultrasonic Transducer. Materials, MDPI, 2021, 14 (9), pp.2269. ⟨10.3390/ma14092269⟩. ⟨hal-03379798⟩

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