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Conference papers

Polydimethylsiloxane micro-channels application for the study of dynamic wetting of nano-etched silicon surfaces based on acoustic characterization method

Abbas Salhab 1, 2 Julien Carlier 1, 3 Pierre Campistron 1, 3 M. Neyens 1 Malika Toubal 1 Bertrand Nongaillard 1, 3 V. Thomy 1, 4
3 MAMINA - IEMN - Matériaux et Acoustiques pour MIcro et NAno systèmes intégrés - IEMN
INSA Hauts-De-France - INSA Institut National des Sciences Appliquées Hauts-de-France, IEMN - Institut d’Électronique, de Microélectronique et de Nanotechnologie - UMR 8520
4 BIOMEMS - IEMN - Bio-Micro-Electro-Mechanical Systems - IEMN
IEMN - Institut d’Électronique, de Microélectronique et de Nanotechnologie - UMR 8520
Abstract : Efficient cleaning of contaminations in the semiconductor industry is a determining factor in ensuring the good quality of the electronics products. We present here the dynamic wetting characterization of a fluid on top of Deep Trench Isolation (DTI) structures using ultra-high frequency acoustic method. The dynamics of the fluid will be established using a PolyDiMethylSiloxane (PDMS) micro-channel placed on top of the structures, in order to obtain conditions as close as possible to those used in the industrial process. Wetting state of the DTI structures is determined based on the measured acoustic reflection coefficient.
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https://hal.archives-ouvertes.fr/hal-03362264
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Submitted on : Monday, October 4, 2021 - 3:50:05 PM
Last modification on : Tuesday, April 26, 2022 - 4:06:04 PM
Long-term archiving on: : Wednesday, January 5, 2022 - 6:50:17 PM

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Abbas Salhab, Julien Carlier, Pierre Campistron, M. Neyens, Malika Toubal, et al.. Polydimethylsiloxane micro-channels application for the study of dynamic wetting of nano-etched silicon surfaces based on acoustic characterization method. 15th International Symposium on Ultra Clean Processing of Semiconductor Surfaces, UCPSS 2021, Session 6 - Wet processing in narrow spaces and pattern collapse, Apr 2021, Virtual, Unknown Region. pp.143-149, ⟨10.4028/www.scientific.net/SSP.314.143⟩. ⟨hal-03362264⟩

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