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Article Dans Une Revue IEEE Transactions on Semiconductor Manufacturing Année : 2021

Investigation of Variation in on-Si on-Wafer TRL Calibration in sub-THz

Résumé

This work presents possible variations in TRL calibrated on-wafer S-parameters measurements with change in the on-wafer reflect design (pad open to pad short or vice-versa) in the TRL calibration method. The variations in each errorterm values due to the change in the on-wafer reflect in the TRL calibration are examined which shows the source match and reflect tracking as possible error-terms bringing the observed variations in the on-wafer TRL calibrated S-parameter. In order to identify sources introducing these variations in the errorterms values and the S-parameters, TRL calibrated on-wafer S-parameters (S11 and S22) of symmetric structures (both reflects i.e. pad open and pad short) are compared. Further, to develop a deep understanding about variations in error-terms values and in the S-parameters, a comprehensive 3D electromagnetic (EM) simulation study is performed. First, EM simulation analyses considering only one structure in simulation setup are performed to examine role of probe-to-probe and probe-to-substrate couplings. Later, EM simulation study is carried out to analyze the impact of the on-wafer neighours, and the spatial position of the on-wafer neighbours. The EM simulation study shows a strong impact of the coupling of the DUT with the on-wafer neighbours, the spatial placement of the on-wafer neighbours, and the design of the reflect whereby the influence of the probe-to-probe coupling is partially masked by the aforementioned effects.
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Dates et versions

hal-03273325 , version 1 (29-06-2021)

Identifiants

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Chandan Yadav, Marina Deng, Sebastien Fregonese, Marco Cabbia, Magali de Matos, et al.. Investigation of Variation in on-Si on-Wafer TRL Calibration in sub-THz. IEEE Transactions on Semiconductor Manufacturing, 2021, 34 (2), pp.145-152. ⟨10.1109/TSM.2021.3073486⟩. ⟨hal-03273325⟩
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