ExaNoDe: Combined Integration of Chiplets on Active Interposer with Bare Dice in a Multi-Chip-Module for Heterogeneous and Scalable High Performance Compute Nodes - Archive ouverte HAL Accéder directement au contenu
Proceedings/Recueil Des Communications Année : 2020

ExaNoDe: Combined Integration of Chiplets on Active Interposer with Bare Dice in a Multi-Chip-Module for Heterogeneous and Scalable High Performance Compute Nodes

Fichier non déposé

Dates et versions

hal-03178715 , version 1 (24-03-2021)

Identifiants

Citer

P. Martinez, Y. Beilliard, M. Godard, D. Danovitch, D. Drouin, et al.. ExaNoDe: Combined Integration of Chiplets on Active Interposer with Bare Dice in a Multi-Chip-Module for Heterogeneous and Scalable High Performance Compute Nodes. 2020 IEEE Symposium on VLSI Technology, Jun 2020, Honolulu, IEEE, pp.1-2, 2020, ⟨10.1109/VLSITechnology18217.2020.9265100⟩. ⟨hal-03178715⟩
25 Consultations
0 Téléchargements

Altmetric

Partager

Gmail Facebook X LinkedIn More