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High Strength-High Conductivity Silver Nanowire-Copper Composite Wires by Spark Plasma Sintering and Wire-Drawing for Non-Destructive Pulsed Fields

Abstract : New Ag-Cu composite wires are developed for the winding of non-destructive pulsed magnets. Silver nanowires were mixed with a micrometric copper powder. Copper and 1, 5 and 10 vol. % silver-copper cylinders were prepared by spark plasma sintering. They served as starting materials for room temperature wire-drawing, enabling the preparation of conducting wires containing copper ultrafine elongated grains and silver nanowires located at the grain boundaries. The tensile strength at 293 K and 77 K for the composite wires is more than twice those for the corresponding pure copper wires. The electrical resistivity is however increased and we show that the composites containing only 1 vol. % silver offer the best compromise
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https://hal.archives-ouvertes.fr/hal-02864517
Contributor : Open Archive Toulouse Archive Ouverte (oatao) <>
Submitted on : Thursday, June 11, 2020 - 10:27:39 AM
Last modification on : Friday, July 10, 2020 - 7:58:48 AM

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Simon Tardieu, David Mesguich, Antoine Lonjon, Florence Lecouturier, Nelson Ferreira, et al.. High Strength-High Conductivity Silver Nanowire-Copper Composite Wires by Spark Plasma Sintering and Wire-Drawing for Non-Destructive Pulsed Fields. IEEE Transactions on Applied Superconductivity, Institute of Electrical and Electronics Engineers, 2020, 30 (4), pp.1-4. ⟨10.1109/TASC.2020.2974420⟩. ⟨hal-02864517⟩

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