Improvements of the Epoxy–Copper Adhesion for Microelectronic Applications

Lérys Granado (1) , Stefan Kempa (2) , Laurence John Gregoriades (2) , Frank Brüning (2) , Tobias Bernhard , Valérie Flaud (1) , Eric Anglaret (3) , Nicole Fréty (1)

1 ICGM - Institut Charles Gerhardt Montpellier - Institut de Chimie Moléculaire et des Matériaux de Montpellier
2 Atotech Deutschland GmbH
3 L2C - Laboratoire Charles Coulomb

Domaines: Matériaux

Lérys Granado, Stefan Kempa, Laurence John Gregoriades, Frank Brüning, Tobias Bernhard, et al.. Improvements of the Epoxy–Copper Adhesion for Microelectronic Applications. ACS Applied Electronic Materials, 2019, 1 (8), pp.1498-1505. ⟨10.1021/acsaelm.9b00290⟩. ⟨hal-02641688⟩