M. S. Chandrasekar and M. Pushpavanam, Pulse and pulse reverse plating-Conceptual, advantages and applications, 2008.

B. Djuric, V. Bley, J. Morand, O. Dagut, J. Cambronne et al., Double side interconnection for vertical power components based on macro and nano structured copper interfaces and printed circuit board technologies, 2019.

K. Feng, B. Decesare, M. Yu, D. Desalvo, and J. Watkowski, Electroplated copper filling of through holes on varying substrate thickness, 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference: Challenges of Change -Shaping the Future, IMPACT 2014 -Proceedings, pp.355-358, 2014.

K. Ganesan, Y. Sun, C. Pendyala, R. Chalupa, S. Nad et al., Marcel Wall, Rahul Manepalli, and Amaneh Tasooji. Innovative Advances in Copper Electroplating for IC Substrate Manufacturing, Proceedings -Electronic Components and Technology Conference, 2017.

C. Show, A. Kou, and . Hung, Studies of Acid Sulfate Copper Pulse Reversal Current Electrodeposition

, Plating & Surface Finishing, issue.135, pp.140-144, 2000.

P. Kristof and M. Pritzker, Improved Copper Plating Through the Use of Current Pulsing & Ultrasonic Agitation, 1998.

N. Bernadette, Électrodéposition par courants pulsés. Techniques de l'ingénieur, 1998.

J. Noppakunkajorn, D. Han, and B. Sarlioglu, Analysis of High-Speed PCB with SiC Devices by Investigating Turn-Off Overvoltage and Interconnection Inductance Influence, IEEE Transactions on Transportation Electrification, vol.1, issue.2, pp.118-125, 2015.

U. Scheuermann and R. Schmidt, Impact of Solder Fatigue on Module Lifetime in Power Cycling Tests, Proceedings of the 2011 14th European Conference on Power Electronics and Applications, pp.1-10, 2011.

B. Xiong, K. W. Loo, and K. Nagarajan, Microvia reliability improvement for high density interconnect substrate, Electronics Packaging Technology Conference, pp.138-141, 2011.