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Optimization of the manufacturing process of macro and nano structures for power modules' interconnection

Abstract : This research aims at the development of a full direct copper interconnection for power modules. The focus lies on the optimization of the manufacturing process of this interconnection via electrodeposition. Particular attention is given to the current profile's parameters to get high quality copper shapes.
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https://hal.archives-ouvertes.fr/hal-02506174
Contributor : Thomas Dias <>
Submitted on : Thursday, March 12, 2020 - 10:51:19 AM
Last modification on : Monday, March 16, 2020 - 9:32:52 AM

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  • HAL Id : hal-02506174, version 1

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Thomas Dias, Bojan Djuric, Vincent Bley, Olivier Dagut, Julien Morand, et al.. Optimization of the manufacturing process of macro and nano structures for power modules' interconnection. IMAPS, POWER 2019, Nov 2019, Tours, France. ⟨hal-02506174⟩

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