EMC Conducted Emission Analysis of a 3D Multilayer Printed Circuit Board with Kron's Method

Z. Xu (1) , Y. Liu (1) , B. Ravelo (2) , O Maurice (3) , J Gantet (4) , N Marier (4) , B. Agnus (5) , S. Carras (6)

1 IRSEEM - Institut de Recherche en Systèmes Electroniques Embarqués
2 Pôle Electronique et Systèmes
3 ARIANE GROUP
4 VALEO – GEEDS
5 SCIENTEAMA
6 FILIX SAS

This paper introduces a fast analysis of signal integrity (SI) and electromagnetic compatibility (EMC) conducted emission (CE) for a multilayer printed circuit board (PCB). The analysis consists in elaborating the ICEM of PCB constituted by electrical interconnect and integrated circuits (ICs) presenting digital and RF/microwave effects. The 3D multilayer PCB including the IC components are modelling with the Kron's formalism using the tensorial analysis of networks (TAN). The equivalent graph topology of the EMC model and the transfer impedance analytical formulation are introduced. The EMC CEs emanated in the PCB are defined from the IC-EMC standardized internal activities. The overall system is modeled in the Kron's equivalent graph. Then, the problem solution is determined from the mesh impedance metric and current calculation. is elaborated in order to establish the metric of the problem. The effectiveness of the developed EMC CE modelling is verified with comparison of frequency domain computations from the TAN method and simulations with a commercial tool. Less computation time of EMC CE voltage noise and transfer impedance spectrums from DC to 1 GHz was pointed out.

Mots clés: Multilayer PCB; Electromagnetic compati- bility (EMC); Kron's method; Signal integrity (SI); Transfer impedance; Conducted emission (CE); IC-EMC model

Domaines: Electronique

Z. Xu, Y. Liu, B. Ravelo, O Maurice, J Gantet, et al.. EMC Conducted Emission Analysis of a 3D Multilayer Printed Circuit Board with Kron's Method. EuMC 2019, Sep 2019, Paris, France. ⟨hal-02485759⟩