Model of mutual coupling between two bonding wires on glass substrate

Thanh Vinh Dinh (1) , Daniel Pasquet (2, 1) , Philippe Descamps (1) , Dominique Lesenechal (1) , Julien Pagazani (3) , Gaelle Bazin Lissorgues (3) , Pierre Nicole (4)

1 LaMIPS - Laboratoire de Microélectronique et de Physique des Semiconducteurs
2 CRISMAT - Laboratoire de cristallographie et sciences des matériaux
3 ESYCOM - Electronique, Systèmes de communication et Microsystèmes
4 THALES Airborne Systems [Elancourt]

This paper presents a simple model of mutual coupling between 2 bonding wires. The model has been compared to 3D full wave electromagnetic simulation up to 20 GHz. A good accordance was obtained.

Mots clés: Mutual coupling; Electromagnetic modeling; Bonding wire; Bonding; Wires; Inductance; Mathematical model; Glass; Solid modeling; Lead bonding; Substrates

Domaines: Electromagnétisme; Matériaux; Micro et nanotechnologies/Microélectronique; Electronique; Biomatériaux

Thanh Vinh Dinh, Daniel Pasquet, Philippe Descamps, Dominique Lesenechal, Julien Pagazani, et al.. Model of mutual coupling between two bonding wires on glass substrate. 2013 International Semiconductor Conference Dresden - Grenoble (ISCDG), Sep 2013, Dresden, Germany. pp.1-4, ⟨10.1109/ISCDG.2013.6656302⟩. ⟨hal-02437447⟩