Skip to Main content Skip to Navigation
Conference papers

Developing new joining materials for low-temperature electronics assembly

Abstract : The present work focuses on a new kind of lead-free joining method for surface-mount technology based on precursor chemistry. The interest of metal oxalates as new soldering materials for die attachment (1st level packaging) was previously demonstrated with silver oxalate. The thermal decomposition of metal oxalates under controlled atmosphere can be used to produce small metal particles below their melting point. These particles are found to be in a highly active particulate form. First experimental studies are focusing on several metal oxalates (tin oxalate and bismuth oxalate) to assess their suitability for low-temperature metal particle production. The main work is dealing with controlled chemical precipitation synthesis and characterization of the compounds as well as study of the properties of decomposition solid products (powder X-ray diffraction, Fourier-transform infrared spectroscopy, scanning electron microscopy and thermal analyses under different atmospheres).
Document type :
Conference papers
Complete list of metadata

Cited literature [4 references]  Display  Hide  Download
Contributor : Open Archive Toulouse Archive Ouverte (OATAO) Connect in order to contact the contributor
Submitted on : Friday, January 10, 2020 - 9:41:09 AM
Last modification on : Wednesday, June 1, 2022 - 4:28:57 AM
Long-term archiving on: : Saturday, April 11, 2020 - 4:36:33 PM


Files produced by the author(s)



Pierre Roumanille, Valérie Baco-Carles, Corine Bonningue, Michel Gougeon, Philippe Tailhades, et al.. Developing new joining materials for low-temperature electronics assembly. 11th IEEE Nanotechnology Materials and Devices Conference (NMDC), Oct 2016, Toulouse, France. pp.1-2, ⟨10.1109/NMDC.2016.7777169⟩. ⟨hal-02434405⟩



Record views


Files downloads