High aspect ratio etched sub-micron structures in silicon obtained by cryogenic plasma deep-etching through perforated polymer thin films

Mukesh Kulsreshath (1) , Alexane Vital (1) , Philippe Lefaucheux (1) , Christophe Sinturel (2) , Thomas Tillocher (1) , Marylène Vayer (2) , Mohamed Boufnichel (3) , Rémi Dussart (1)

1 GREMI - Groupe de recherches sur l'énergétique des milieux ionisés
2 ICMN - Interfaces, Confinement, Matériaux et Nanostructures
3 ST-TOURS - STMicroelectronics [Tours]

Domaines: Micro et nanotechnologies/Microélectronique

Mukesh Kulsreshath, Alexane Vital, Philippe Lefaucheux, Christophe Sinturel, Thomas Tillocher, et al.. High aspect ratio etched sub-micron structures in silicon obtained by cryogenic plasma deep-etching through perforated polymer thin films. Micro and Nano Engineering, 2018, 1, pp.42-48. ⟨10.1016/j.mne.2018.10.007⟩. ⟨hal-02267745⟩