Validation of finite element structural simulation for ohmic microcontact

H. Liu , Dimitri Leray (1) , P. Pons , Stéphane Colin (1) , A. Broué , J. Martegoutte

1 ICA - Institut Clément Ader

In the current literature, there is no model able to accurately predict the electrical resistance value of rough microcontacts. Such model requires a coupled thermo-electro-structural analysis that is very difficult to validate in a straightforward manner. In the present approach, atomic force microscopy (AFM) scanned data of contact surface with roughness are used to build finite element (FE) model. As a first step towards multiphysics analysis, the aim of this study is to validate results of structural simulation of a rough gold micro-contact. A setup with a nanoindenter and a real microswitch is used to extract force-displacement curves. These results are compared to FE simulations which allow evaluating the effects of the main parameters. It is shown that the accuracy of these structural simulations is acceptable for an accurate evaluation of the electrical contact resistance.

Domaines: Matériaux et structures en mécanique [physics.class-ph]

H. Liu, Dimitri Leray, P. Pons, Stéphane Colin, A. Broué, et al.. Validation of finite element structural simulation for ohmic microcontact. Eurosensors XXV, September 4-7, 2011, Athens, Greece (in Procedia Engineering, vol. 25), 2011, Athens, Greece. pp.419-422, ⟨10.1016/j.proeng.2011.12.104⟩. ⟨hal-02187942⟩