A. Karkar, T. Mak, K. Tong, and A. Yakovlev, A Survey of Emerging Interconnects for On-Chip Efficient Multicast and Broadcast in Many-Cores, IEEE Circuits and Systems Magazine, vol.16, issue.1, pp.58-72, 2016.

, Présentation -CominLabs

T. S. Rappaport, J. N. Murdock, and F. Gutierrez, State of the Art in 60-GHz Integrated Circuits and Systems for Wireless Communications, Proceedings of the IEEE, vol.99, issue.8, pp.1390-1436, 2011.

H. M. Cheema and A. Shamim, The last barrier: on-chip antennas, IEEE Microwave Magazine, vol.14, issue.1, pp.79-91, 2013.

R. Allanic, Three-state Microwave Tunable Resonator Integrating Several Active Elements on Silicon Technology in a Global Design, IEEE Microw. Wirel. Components Lett, 2018.
URL : https://hal.archives-ouvertes.fr/hal-01697967

A. Hajimiri, IEEE 2007 Custom Intergrated Circuits Conference (CICC), pp.741-747, 2007.

S. Deb, A. Ganguly, P. P. Pande, B. Belzer, and D. Heo, Wireless NoC as Interconnection Backbone for Multicore Chips: Promises and Challenges, IEEE Journal on Emerging and Selected Topics in Circuits and Systems, vol.2, issue.2, pp.228-239, 2012.

Y. P. Zhang, M. Sun, K. M. Chua, L. L. Wai, and D. Liu, Antenna-in-Package Design for Wirebond Interconnection to Highly Integrated 60-GHz Radios, IEEE Transactions on Antennas and Propagation, vol.57, issue.10, pp.2842-2852, 2009.

B. Wu, Experimental demonstration of a transparent graphene millimetre wave absorber with 28% fractional bandwidth at 140 GHz, Scientific Reports, vol.4, issue.1, 2015.

X. Zheng, Y. Chen, W. Wang, and S. Yang, Development of Metamaterial EBG Absorbers for Application of Wireless Inter/Intrachip Communication Systems, Metamaterials -Devices and Applications, 2017.