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Assessment of Dielectric Encapsulation for High Temperature High Voltage Modules

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https://hal.archives-ouvertes.fr/hal-02124292
Contributor : Sylvie Garcia <>
Submitted on : Thursday, May 9, 2019 - 1:54:14 PM
Last modification on : Thursday, November 19, 2020 - 1:00:32 PM

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  • HAL Id : hal-02124292, version 1

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Rabih Khazaka, Laurent Mendizabal, D. Henry, Rachelle Hanna, Olivier Lesaint. Assessment of Dielectric Encapsulation for High Temperature High Voltage Modules. In Electronic Components and Technology Conference (ECTC), 2015, Jul 2015, Brighton, United Kingdom. ⟨hal-02124292⟩

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