Study of tantalum and iridium as adhesion layers for Pt/LGS high temperature SAW devices

Thierry Aubert (1) , Omar Elmazria (1) , Badreddine Assouar (1) , Laurent Bouvot (1) , Zoumnone Bournebe (1) , Michel Hehn (1) , Sylvain Weber (1) , Mourad Oudich (1) , Patrick Alnot (1)

1 IJL - Institut Jean Lamour

In this paper, we report on the use of tantalum and iridium as adhesion layers for platinum electrodes used in high temperature SAW devices based on langasite substrates (LGS). Unlike iridium, tantalum exhibits a great adhesive strength, and a very low mobility through the Pt film, ensuring a device lifetime of at least half an hour at 1000°C. The latter is limited by morphological modifications of platinum, starting by the apparition of crystallites on the surface, and followed by important terracing and breaking of the film continuity. SNMS and XRD measurements allowed us to show that these phenomena are likely intrinsic to platinum film, whatever be the nature of the adhesion layer. Finally, after having outlined a possible scenario leading to this deterioration, we consider some solutions that could replace platinum in order to increase the lifetime of LGS-based SAW devices in high temperatures conditions.

Mots clés: high temperature; platinum; SAW; langasite; tantalum

Domaines: Science des matériaux [cond-mat.mtrl-sci]; Micro et nanotechnologies/Microélectronique

Thierry Aubert, Omar Elmazria, Badreddine Assouar, Laurent Bouvot, Zoumnone Bournebe, et al.. Study of tantalum and iridium as adhesion layers for Pt/LGS high temperature SAW devices. IEEE International Ultrasonics Symposium, Sep 2009, Rome, Italy. ⟨hal-02114812⟩