Thermo-mechanical characterization of passive stress sensors in Si interposer

Stephanie Escoubas (1) , Benjamin Vianne (2, 1) , Pierre Bar , Vincent Fiori (3) , Sebastien Gallois-Garreignot (2) , Komi Atchou Ewuame (2) , Pascal Chausse , Stéphanie Escoubas (1) , Nicolas Hotellier , Olivier Thomas (1)

1 IM2NP - Institut des Matériaux, de Microélectronique et des Nanosciences de Provence
2 ST-CROLLES - STMicroelectronics [Crolles]
3 STMicroelectronics

Domaines: Matériaux

Stephanie Escoubas, Benjamin Vianne, Pierre Bar, Vincent Fiori, Sebastien Gallois-Garreignot, et al.. Thermo-mechanical characterization of passive stress sensors in Si interposer. Microelectronics Reliability, 2015, 55 (5), pp.738-746. ⟨10.1016/j.microrel.2015.02.005⟩. ⟨hal-02114621⟩