Strain and tilt mapping in silicon around copper filled TSVs using advanced X-ray nano-diffraction

B. Vianne (1, 2) , Stephanie Escoubas (2) , M.-I. Richard (2) , S. Labat (2) , G. Chahine (3) , T. Schulli (4) , A. Farcy (5) , P. Bar (1) , V. Fiori (5) , O. Thomas (2)

1 ST-CROLLES - STMicroelectronics [Crolles]
2 IM2NP - Institut des Matériaux, de Microélectronique et des Nanosciences de Provence
3 SIMaP - Science et Ingénierie des Matériaux et Procédés
4 ESRF - European Synchrotron Radiation Facility
5 STMicroelectronics

Domaines: Science des matériaux [cond-mat.mtrl-sci]

B. Vianne, Stephanie Escoubas, M.-I. Richard, S. Labat, G. Chahine, et al.. Strain and tilt mapping in silicon around copper filled TSVs using advanced X-ray nano-diffraction. Microelectronic Engineering, 2015, 137, pp.117-123. ⟨10.1016/j.mee.2014.12.011⟩. ⟨hal-02114614⟩