J. W. Dini and D. D. Snyder, Electrodeposition of copper, Modern electroplating, pp.33-78, 2010.

C. Gabrielli, P. Moçotéguy, H. Perrot, D. Nieto-sanz, and A. Zdunek, A model for copper deposition in the damascene process, Electrochimica Acta, vol.51, issue.8-9, pp.1462-1472, 2006.

C. Gabrielli, P. Moçotéguy, H. Perrot, D. Nieto-sanz, and A. Zdunek, An investigation of copper interconnect deposition bath ageing by electrochemical impedance spectroscopy, Journal of Appled Electrochemistry, vol.38, issue.4, pp.457-468, 2008.
DOI : 10.1007/s10800-007-9459-1

C. Gabrielli, P. Mocoteguy, H. Perrot, A. Zdunek, P. Bouard et al., Electrochemical Impedance spectroscopy investigation of bath aging in damascene process chemistries, Electrochemical and Solid-State Letters, vol.7, issue.3, p.31, 2004.
DOI : 10.1149/1.1643793

C. Gabrielli, P. Mocoteguy, H. Perrot, A. Zdunek, and D. Nieto-sanz, Influence of the anode on the degradation of the additives in the damascene process for copper deposition, Journal of the Electrochemical Society, vol.154, issue.3, p.163, 2007.

R. Gouriveau, K. Medjaher, and N. Zerhouni, From prognostics and health systems management to predictive maintenance 1: Monitoring and prognostics, 2016.
DOI : 10.1002/9781119371052

S. I. Imai and M. Kitabata, Prevention of copper interconnection failure in system on chip using virtual metrology, IEEE Transactions on Semiconductor Manufacturing, vol.22, issue.4, pp.432-437, 2009.

S. I. Imai, M. Kitabata, and T. Tanaka, Interconnection failure caused by bath degradation in copper electroplating and its VM-FDC using mathematical model, Advanced semiconductor manufacturing conference (ASMC), pp.254-258, 2009.
DOI : 10.1109/asmc.2009.5155995

A. Jaworski, H. Wikiel, and K. Wikiel, Voltammetry coupled with multiway chemometrics for monitoring and diagnosis of electrodeposition process, Electroanalysis, vol.23, issue.1, pp.253-263, 2011.

A. Jaworski, H. Wikiel, and K. Wikiel, Automated AC voltammetric sensor for early fault detection and diagnosis in monitoring of electroplating processes, Electroanalysis, vol.25, issue.1, pp.278-288, 2013.

D. D. Macdonald, E. Sikora, and G. Engelhardt, Characterizing electrochemical systems in the frequency domain, Electrochimica Acta, vol.43, pp.87-107, 1998.
DOI : 10.1016/s0013-4686(97)00238-7

P. M. Ming, D. Zhu, Y. B. Zeng, and Y. Y. Hu, Wear resistance of copper EDM tool electrode electroformed from copper sulfate baths and pyrophosphate baths, The International Journal of Advanced Manufacturing Technology, vol.50, issue.5, pp.635-641, 2010.
DOI : 10.1007/s00170-010-2552-3

A. Mosallam, K. Medjaher, and N. Zerhouni, Nonparametric time series modelling for industrial prognostics and health management, The International Journal of Advanced Manufacturing Technology, vol.69, issue.5, pp.1685-1699, 2013.
DOI : 10.1007/s00170-013-5065-z
URL : https://hal.archives-ouvertes.fr/hal-00867702

A. Mosallam, K. Medjaher, and N. Zerhouni, Data-driven prognostic method based on Bayesian approaches for direct remaining useful life prediction, Journal of Intelligent Manufacturing, vol.27, issue.5, pp.1037-1048, 2016.
DOI : 10.1007/s10845-014-0933-4
URL : https://hal.archives-ouvertes.fr/hal-01025442

M. Paunovic and M. Schlesinger, Fundamentals of electrochemical deposition, pp.77-112, 2006.
DOI : 10.1002/0470009403

P. Morales, U. Mariño-camargo, A. Olaya, and J. J. , , 2010.

, Diagramas Típicos Con Circuitos Equivalentes electrochemical impedance-interpretation of typical diagrams with equivalent circuits, vol.77, pp.69-75

G. K. Poon, D. J. Williams, and K. S. Chin, Optimising the lithographic patterning effect in an acid copper electroplating process, The International Journal of Advanced Manufacturing Technology, vol.16, issue.12, pp.881-888, 2000.
DOI : 10.1007/s001700070006

A. Ragab, M. S. Ouali, S. Yacout, and H. Osman, Remaining useful life prediction using prognostic methodology based on logical analysis of data and Kaplan-Meier estimation, Journal of Intelligent Manufacturing, vol.27, issue.5, pp.943-958, 2016.
DOI : 10.1007/s10845-014-0926-3

A. Ragab, S. Yacout, M. Ouali, and H. Osman, Prognostics of multiple failure modes in rotating machinery using a patternbased classifier and cumulative incidence functions, Journal of Intelligent Manufacturing, 2016.

S. Schuldiner and M. Rosen, The exchange current density vs. concentration relation and its use in a rigorous determination of solution purity, Journal of Electroanalytical Chemistry and Interfacial Electrochemistry, vol.35, issue.1, pp.1-6, 1972.

J. Z. Sikorskaa, M. Hodkiewicz, and L. Ma, Prognostic modelling options for remaining useful life estimation by industry, Mechanical Systems and Signal Processing, vol.25, issue.5, pp.1803-1836, 2011.

K. M. Takahashi, Electroplating copper onto resistive barrier films, Journal of the Electrochemical Society, vol.147, issue.4, p.1414, 2000.
DOI : 10.1149/1.1393370

T. Tsai, A hybrid intelligent approach for optimizing the fine-pitch copper wire bonding process with multiple quality characteristics in IC assembly, Journal of Intelligent Manufacturing, vol.25, issue.1, pp.117-192, 2014.

M. Vaezi, H. Seitz, and S. Yang, A review on 3D microadditive manufacturing technologies, The International Journal of Advanced Manufacturing Technology, vol.67, issue.5, pp.1721-1754, 2013.
DOI : 10.1007/s00170-012-4605-2

G. W. Vogl, B. A. Weiss, and M. Helu, A review of diagnostic and prognostic capabilities and best practices for manufacturing, Journal of Intelligent Manufacturing, 2016.

C. Yu, P. Wang, X. Gao, and H. Wang, A novel mathematical method for equivalent circuit modeling determination for electrochemical impedance spectroscopy to study corrosion behavior of corrosion resistant steel, International Journal of Electrochemical Science, vol.10, issue.1, pp.538-551, 2015.