Smart Packaging: A micro-sensor array integrated to a flip-chip package to investigate the effect of humidity in microelectronics package

A. Quelennec (1, 2, 3) , U. Shafique (4, 2, 3) , E Duchesne , H. Fremont (1) , D. Drouin (4, 2, 3)

1 IMS - Laboratoire de l'intégration, du matériau au système
2 LN2 - Laboratoire Nanotechnologies Nanosystèmes
3 3IT - Institut Interdisciplinaire d'Innovation Technologique [Sherbrooke]
4 UdeS - Université de Sherbrooke

Domaines: Sciences de l'ingénieur [physics]

A. Quelennec, U. Shafique, E Duchesne, H. Fremont, D. Drouin. Smart Packaging: A micro-sensor array integrated to a flip-chip package to investigate the effect of humidity in microelectronics package. IEEE Electronic Components and Technology Conf., May 2017, Orlando, United States. ⟨hal-02097247⟩